Detail publikace

Bonding of zero-shrink LTCC with alumina ceramics

Originální název

Bonding of zero-shrink LTCC with alumina ceramics

Anglický název

Bonding of zero-shrink LTCC with alumina ceramics

Jazyk

en

Originální abstrakt

Low Temperature Co-fired Ceramic (LTCC) is widely used for manufacturing electrical systems in 3D configuration. LTCC substrates were so far bonded with alumina ceramics using additional adhesive layers with subsequent firing or curing cycle. With the advent of the zero-shrink LTCC substrates it is now possible to bond unfired substrates with other fired substrates; for example fired LTCC or alumina substrates. Alumina substrate in combination with LTCC brings advantages of good thermal conductivity for usage in heating elements or packaging. This paper is focused on a description of reliable bonding technique of zero-shrink LTCC and alumina ceramics.

Anglický abstrakt

Low Temperature Co-fired Ceramic (LTCC) is widely used for manufacturing electrical systems in 3D configuration. LTCC substrates were so far bonded with alumina ceramics using additional adhesive layers with subsequent firing or curing cycle. With the advent of the zero-shrink LTCC substrates it is now possible to bond unfired substrates with other fired substrates; for example fired LTCC or alumina substrates. Alumina substrate in combination with LTCC brings advantages of good thermal conductivity for usage in heating elements or packaging. This paper is focused on a description of reliable bonding technique of zero-shrink LTCC and alumina ceramics.

BibTex


@article{BUT115431,
  author="Jakub {Somer} and Michal {Štekovič} and František {Urban} and Josef {Šandera} and Ivan {Szendiuch}",
  title="Bonding of zero-shrink LTCC with alumina ceramics",
  annote="Low Temperature Co-fired Ceramic (LTCC) is widely used for manufacturing electrical systems in 3D configuration. LTCC substrates were so far bonded with alumina ceramics using additional adhesive layers with subsequent firing or curing cycle. With the advent of the zero-shrink LTCC substrates it is now possible to bond unfired substrates with other fired substrates; for example fired LTCC or alumina substrates. Alumina substrate in combination with LTCC brings advantages of good thermal conductivity for usage in heating elements or packaging. This paper is focused on a description of reliable bonding technique of zero-shrink LTCC and alumina ceramics.",
  address="Emerald Group Publishing Limited",
  chapter="115431",
  doi="10.1108/SSMT-10-2014-0021",
  howpublished="online",
  institution="Emerald Group Publishing Limited",
  number="4",
  volume="27",
  year="2015",
  month="august",
  pages="157--163",
  publisher="Emerald Group Publishing Limited",
  type="journal article"
}