Detail publikace

TECHNOLOGICAL ASPECTS OF REWORK

Originální název

TECHNOLOGICAL ASPECTS OF REWORK

Anglický název

TECHNOLOGICAL ASPECTS OF REWORK

Jazyk

en

Originální abstrakt

The paper deals with the technological aspects of rework. There are introduced some of these aspects as ambient temperature and ambient humidity, handling and storing devices and components, operators work, reflow soldering thermal profile, influence of flux. Technological aspects negatively influence reliability of soldering process, it is important to pay close attention to this phenomenon. They also have negative influence on repair yield.

Anglický abstrakt

The paper deals with the technological aspects of rework. There are introduced some of these aspects as ambient temperature and ambient humidity, handling and storing devices and components, operators work, reflow soldering thermal profile, influence of flux. Technological aspects negatively influence reliability of soldering process, it is important to pay close attention to this phenomenon. They also have negative influence on repair yield.

BibTex


@inproceedings{BUT114289,
  author="Pavel {Řihák}",
  title="TECHNOLOGICAL ASPECTS OF REWORK",
  annote="The paper deals with the technological aspects of rework. There are introduced some of
these aspects as ambient temperature and ambient humidity, handling and storing devices and components,
operators work, reflow soldering thermal profile, influence of flux. Technological aspects
negatively influence reliability of soldering process, it is important to pay close attention to this
phenomenon. They also have negative influence on repair yield.",
  address="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních",
  booktitle="Proceedings of the 21st Conference STUDENT EEICT 2015",
  chapter="114289",
  howpublished="electronic, physical medium",
  institution="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních",
  year="2015",
  month="april",
  pages="396--400",
  publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních",
  type="conference paper"
}