Detail publikace

Wettability SnPb and Lead-free

SZENDIUCH, I., BULVA, J.

Originální název

Wettability SnPb and Lead-free

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

Lead free soldering implementation process needs some knowledge about behavior of lead-free materials where fundamental seems to be wettability. Without good wettability the process performance cannot be convenient technical and economical too. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, which are important for solder joint formation, and for final solder joint reliability. This includes optimal selection of fluxes, air/nitrogen atmosphere, solders alloy compositions, surface treatments of components and PCBs and other factors. This paper presents some facts from this area.

Klíčová slova

lead free soldering, wettability

Autoři

SZENDIUCH, I., BULVA, J.

Rok RIV

2004

Vydáno

1. 1. 2004

Nakladatel

Ing. Zdeněk Novotný CSc.,Brno

Místo

Brno

ISBN

80-214-2701-9

Kniha

11th Electronic Devices and Systems Conference 2004 Proceedings

Strany od

407

Strany do

411

Strany počet

5

BibTex

@inproceedings{BUT11423,
  author="Ivan {Szendiuch} and Jindřich {Bulva}",
  title="Wettability SnPb and Lead-free",
  booktitle="11th Electronic Devices and Systems Conference 2004 Proceedings",
  year="2004",
  pages="407--411",
  publisher="Ing. Zdeněk Novotný CSc.,Brno",
  address="Brno",
  isbn="80-214-2701-9"
}