Detail publikace

Impact of solder paste drying on the solderability

OTÁHAL, A. ADÁMEK, M. SZENDIUCH, I.

Originální název

Impact of solder paste drying on the solderability

Český název

Impact of solder paste drying on the solderability

Typ

článek ve sborníku

Jazyk

cs

Originální abstrakt

This paper deals with the influence of the dried no-clean SAC305 solder paste on the spreading factor. Drying was defined by time between stencil printing and reflow soldering. Main investigated parameter was spreading, which is percentage difference between diameter of circle of solder paste after printing and diameter of circle after soldering.

Český abstrakt

This paper deals with the influence of the dried no-clean SAC305 solder paste on the spreading factor. Drying was defined by time between stencil printing and reflow soldering. Main investigated parameter was spreading, which is percentage difference between diameter of circle of solder paste after printing and diameter of circle after soldering.

Klíčová slova

copper alloys, drying, reflow soldering, silver alloys, solders, tin alloys

Rok RIV

2014

Vydáno

20.08.2014

Nakladatel

IEEE

Místo

Dresden

ISBN

978-1-4799-4455-2

Kniha

37th Int. Spring Seminar on Electronics Technology

Strany od

198

Strany do

201

Strany počet

495

BibTex


@inproceedings{BUT109636,
  author="Alexandr {Otáhal} and Martin {Adámek} and Ivan {Szendiuch}",
  title="Impact of solder paste drying on the solderability",
  annote="This paper deals with the influence of the dried no-clean SAC305 solder paste on the spreading factor. Drying was defined by time between stencil printing and reflow soldering. Main investigated parameter was spreading, which is percentage difference between diameter of circle of solder paste after printing and diameter of circle after soldering.",
  address="IEEE",
  booktitle="37th Int. Spring Seminar on Electronics Technology",
  chapter="109636",
  doi="10.1109/ISSE.2014.6887592",
  howpublished="online",
  institution="IEEE",
  number="37",
  year="2014",
  month="august",
  pages="198--201",
  publisher="IEEE",
  type="conference paper"
}