Detail publikace

Analytic method for monitoring of cleaning process efficiency

BURŠÍK, M. JANKOVSKÝ, J. ŘEZNÍČEK, M. SZENDIUCH, I.

Originální název

Analytic method for monitoring of cleaning process efficiency

Český název

Analytic method for monitoring of cleaning process efficiency

Typ

článek ve sborníku

Jazyk

cs

Originální abstrakt

This paper is focused on cleaning processes commonly used in electronic industry. Cleaning equipment serve to remove residual contamination after soldering of components in order to achieve the highest possible reliability and efficiency. In the real cleaning process is not possible during cleaning process to move products outside from equipment to make evaluation of cleaning efficiency.

Český abstrakt

This paper is focused on cleaning processes commonly used in electronic industry. Cleaning equipment serve to remove residual contamination after soldering of components in order to achieve the highest possible reliability and efficiency. In the real cleaning process is not possible during cleaning process to move products outside from equipment to make evaluation of cleaning efficiency.

Klíčová slova

Cleaning, contamination, flux, analyze, monitoring

Rok RIV

2014

Vydáno

20.08.2014

Nakladatel

IEEE

Místo

Dresden, Německo

ISBN

978-3-934142-49-7

Kniha

IEEE CONFERENCE PUBLICATIONS

Strany od

341

Strany do

344

Strany počet

4

BibTex


@inproceedings{BUT109630,
  author="Martin {Buršík} and Jaroslav {Jankovský} and Michal {Řezníček} and Ivan {Szendiuch}",
  title="Analytic method for monitoring of cleaning process efficiency",
  annote="This paper is focused on cleaning processes commonly used in electronic industry. Cleaning equipment serve to remove residual contamination after soldering of components in order to achieve the highest possible reliability and efficiency. In the real cleaning process is not possible during cleaning process to move products outside from equipment to make evaluation of cleaning efficiency.",
  address="IEEE",
  booktitle="IEEE CONFERENCE PUBLICATIONS",
  chapter="109630",
  doi="10.1109/ISSE.2014.6887620",
  howpublished="electronic, physical medium",
  institution="IEEE",
  year="2014",
  month="august",
  pages="341--344",
  publisher="IEEE",
  type="conference paper"
}