Detail publikace

Usage of Low-Temperature Co-Fired Ceramic In Hermetic Packaging

Originální název

Usage of Low-Temperature Co-Fired Ceramic In Hermetic Packaging

Anglický název

Usage of Low-Temperature Co-Fired Ceramic In Hermetic Packaging

Jazyk

en

Originální abstrakt

This article deals with usage of low-temperature co-fired ceramic as a material for hermetic package of bare-dies. Two types of substrates are measured – Heraeus HeraLock2000 and DuPont GreenTape 951PT. For more accurate results, different arrays of vias are designed to imitate conductive joints in a package. An air-tightness of samples is determined based on Oxygen Transmission Rate measurement. Dependence of the air-tightness on a material thickness and on a count of vias was investigated. Design and fabrication of the samples and measurement description is also included. Results of this experiment compare mentioned types of ceramics and create a base of knowledge for design of an air-tight package.

Anglický abstrakt

This article deals with usage of low-temperature co-fired ceramic as a material for hermetic package of bare-dies. Two types of substrates are measured – Heraeus HeraLock2000 and DuPont GreenTape 951PT. For more accurate results, different arrays of vias are designed to imitate conductive joints in a package. An air-tightness of samples is determined based on Oxygen Transmission Rate measurement. Dependence of the air-tightness on a material thickness and on a count of vias was investigated. Design and fabrication of the samples and measurement description is also included. Results of this experiment compare mentioned types of ceramics and create a base of knowledge for design of an air-tight package.

BibTex


@proceedings{BUT108117,
  author="Martin {Klíma} and Jakub {Somer} and Lucie {Blahová} and Michal {Procházka} and Ivan {Szendiuch}",
  title="Usage of Low-Temperature Co-Fired Ceramic In Hermetic Packaging",
  annote="This article deals with usage of low-temperature co-fired ceramic as a material for hermetic package of bare-dies. Two types of substrates are measured – Heraeus HeraLock2000 and DuPont GreenTape 951PT. For more accurate results, different arrays of vias are designed to imitate conductive joints in a package. An air-tightness of samples is determined based on Oxygen Transmission Rate measurement. Dependence of the air-tightness on a material thickness and on a count of vias was investigated. Design and fabrication of the samples and measurement description is also included. Results of this experiment compare mentioned types of ceramics and create a base of knowledge for design of an air-tight package.",
  booktitle="Advances in Electronic System Integration - Book of Abtracts 37th International Spring Seminar on Electronics Technology",
  chapter="108117",
  doi="10.1109/ISSE.2014.6887571",
  howpublished="online",
  year="2014",
  month="august",
  pages="99--103",
  type="conference proceedings"
}