Detail publikace
Connection of electronic and microelectronic modules
ŠANDERA, J.
Originální název
Connection of electronic and microelectronic modules
Český název
Connection of electronic and microelectronic modules
Typ
článek v časopise ve Web of Science, Jimp
Jazyk
cs
Originální abstrakt
The purpose of this article is to describe the design of electronic and microelectronic modules and, in particular, it focuses on connecting system of electrical modules to the main board of printed board. The theory of thermomechanical loading of system is presented. New methods of rigid solder connection for electronic modules are also presented.
Český abstrakt
The purpose of this article is to describe the design of electronic and microelectronic modules and, in particular, it focuses on connecting system of electrical modules to the main board of printed board. The theory of thermomechanical loading of system is presented. New methods of rigid solder connection for electronic modules are also presented.
Klíčová slova
Connection with component; Electronic and microelectronic modules; Flexible connection; Rigid connection
Rok RIV
2014
Vydáno
27.05.2014
Nakladatel
Emerald Group
Místo
England
ISSN
1356-5362
Periodikum
MICROELECTRONICS INTERNATIONAL
Ročník
31
Číslo
2
Stát
GB
Strany od
86
Strany do
89
Strany počet
4
Dokumenty
BibTex
@article{BUT107696,
author="Josef {Šandera}",
title="Connection of electronic and microelectronic modules",
annote="The purpose of this article is to describe the design of electronic and microelectronic modules and, in particular, it focuses on connecting system of electrical modules to the main board of printed board. The theory of thermomechanical loading of system is presented. New methods of rigid solder connection for electronic modules are also presented.",
address="Emerald Group",
chapter="107696",
doi="10.1108/MI-10-2013-0053",
institution="Emerald Group",
number="2",
volume="31",
year="2014",
month="may",
pages="86--89",
publisher="Emerald Group",
type="journal article in Web of Science"
}