Detail publikace

Connection of electronic and microelectronic modules

ŠANDERA, J.

Originální název

Connection of electronic and microelectronic modules

Český název

Connection of electronic and microelectronic modules

Typ

článek v časopise ve Web of Science, Jimp

Jazyk

cs

Originální abstrakt

The purpose of this article is to describe the design of electronic and microelectronic modules and, in particular, it focuses on connecting system of electrical modules to the main board of printed board. The theory of thermomechanical loading of system is presented. New methods of rigid solder connection for electronic modules are also presented.

Český abstrakt

The purpose of this article is to describe the design of electronic and microelectronic modules and, in particular, it focuses on connecting system of electrical modules to the main board of printed board. The theory of thermomechanical loading of system is presented. New methods of rigid solder connection for electronic modules are also presented.

Klíčová slova

Connection with component; Electronic and microelectronic modules; Flexible connection; Rigid connection

Rok RIV

2014

Vydáno

27.05.2014

Nakladatel

Emerald Group

Místo

England

ISSN

1356-5362

Periodikum

MICROELECTRONICS INTERNATIONAL

Ročník

31

Číslo

2

Stát

GB

Strany od

86

Strany do

89

Strany počet

4

Dokumenty

BibTex 


@article{BUT107696,
  author="Josef {Šandera}",
  title="Connection of electronic and microelectronic modules",
  annote="The purpose of this article is to describe the design of electronic and microelectronic modules and, in particular, it focuses on connecting system of electrical modules to the main board of printed board. The theory of thermomechanical loading of system is presented. New methods of rigid solder connection for electronic modules are also presented.",
  address="Emerald Group",
  chapter="107696",
  doi="10.1108/MI-10-2013-0053",
  institution="Emerald Group",
  number="2",
  volume="31",
  year="2014",
  month="may",
  pages="86--89",
  publisher="Emerald Group",
  type="journal article in Web of Science"
}