Detail publikace

Temperature cycling with Peltier elements of boards with SMD components and failure evaluation

ŠANDERA, J. NICÁK, M.

Originální název

Temperature cycling with Peltier elements of boards with SMD components and failure evaluation

Český název

Temperature cycling with Peltier elements of boards with SMD components and failure evaluation

Typ

článek v časopise

Jazyk

cs

Originální abstrakt

This article aims to discuss the construction of a system for temperature cycling, where Peltier elements are used as heating or cooling elements.This article describes the results and experiences based on several years of practice in the area of thermo-mechanical reliability of soldered joints on printed boards with SMD components.

Český abstrakt

This article aims to discuss the construction of a system for temperature cycling, where Peltier elements are used as heating or cooling elements.This article describes the results and experiences based on several years of practice in the area of thermo-mechanical reliability of soldered joints on printed boards with SMD components.

Klíčová slova

Assembly, Fatigue, SMD, Thermal fatigue

Vydáno

27.03.2014

Nakladatel

Emerald Group Publishing Limited

Místo

England

Strany od

53

Strany do

61

Strany počet

8

BibTex


@article{BUT106754,
  author="Josef {Šandera} and Michal {Nicák}",
  title="Temperature cycling with Peltier elements of boards with SMD components and failure evaluation",
  annote="This article aims to discuss the construction of a system for temperature cycling, where Peltier elements are used as heating or cooling elements.This article describes the results and experiences based on several years of practice in the area of thermo-mechanical reliability of soldered joints on printed boards with SMD components.",
  address="Emerald Group Publishing Limited",
  chapter="106754",
  doi="10.1108/SSMT-02-2013-0004",
  institution="Emerald Group Publishing Limited",
  number="2",
  volume="26",
  year="2014",
  month="march",
  pages="53--61",
  publisher="Emerald Group Publishing Limited",
  type="journal article"
}