Detail publikace

Temperature Cycling with Peltier Elements of Boards with SMD Components and Failure Evaluation

Originální název

Temperature Cycling with Peltier Elements of Boards with SMD Components and Failure Evaluation

Anglický název

Temperature Cycling with Peltier Elements of Boards with SMD Components and Failure Evaluation

Jazyk

en

Originální abstrakt

This article discusses the construction of a system for temperature cycling, where Peltier elements are used as heating or cooling elements. Thisarticle describes the results and experiences based on several years of practice in the area of thermo-mechanical reliability of soldered joints on printed boards with SMD components.

Anglický abstrakt

This article discusses the construction of a system for temperature cycling, where Peltier elements are used as heating or cooling elements. Thisarticle describes the results and experiences based on several years of practice in the area of thermo-mechanical reliability of soldered joints on printed boards with SMD components.

BibTex


@article{BUT106346,
  author="Josef {Šandera} and Michal {Nicák}",
  title="Temperature Cycling with Peltier Elements of Boards with SMD Components and Failure Evaluation",
  annote="This article discusses the construction of a system for temperature cycling, where Peltier elements are used as heating or cooling elements. Thisarticle describes the results and experiences based on several years of practice in the area of thermo-mechanical reliability of soldered joints on printed boards with SMD components.",
  address="Emerald Group",
  chapter="106346",
  doi="10.1108/SSMT-02-2013-0004",
  institution="Emerald Group",
  number="2",
  volume="26",
  year="2014",
  month="march",
  pages="53--61",
  publisher="Emerald Group",
  type="journal article"
}