Detail publikace

The Use of Computer Simulation in the Electronic Packaging Process

PSOTA, B. BURŠÍK, M. SZENDIUCH, I.

Originální název

The Use of Computer Simulation in the Electronic Packaging Process

Typ

abstrakt

Jazyk

angličtina

Originální abstrakt

This paper deals with the problem of the wirebonding process, which is modeled in the simulation process for prediction of the final loop shape. The creation of the virtual model and its evaluation is described.

Klíčová slova

Simulation, Wirebonding, Ansys

Autoři

PSOTA, B.; BURŠÍK, M.; SZENDIUCH, I.

Vydáno

1. 7. 2013

Místo

Brno, Česká republika

ISBN

978-80-214-4739-4

Kniha

Materials Structure & Micromechanics of Fracture

Strany od

182

Strany do

182

Strany počet

1

BibTex

@misc{BUT104293,
  author="Boleslav {Psota} and Martin {Buršík} and Ivan {Szendiuch}",
  title="The Use of Computer Simulation in the Electronic Packaging Process",
  booktitle="Materials Structure & Micromechanics of Fracture",
  year="2013",
  pages="182--182",
  address="Brno, Česká republika",
  isbn="978-80-214-4739-4",
  note="abstract"
}