Detail publikace

Board on Board New PCB Configuration Moving in 3D Packaging

SZENDIUCH, I. PSOTA, B. OTÁHAL, A. HEJÁTKOVÁ, E.

Originální název

Board on Board New PCB Configuration Moving in 3D Packaging

Anglický název

Board on Board New PCB Configuration Moving in 3D Packaging

Jazyk

en

Originální abstrakt

This paper describes the main idea of EURIPIDES project Board on Board (BoB) supervised by Thales Communication. The aim of this project is to develop and validate an innovative solution for realization of high-density boards beyond the SMD limits found, remaining reliable and reparable. In more the challenge is to satisfy the customer demand regarding the reliability in harsh environments and in long mission profile. An innovative solution is to have two boards with components only on one face and assembled then in such a way that it is possible to take them apart if repairing is needed. To reach such challenging objective, all the supply chain is needed, from base materials provider up to end-users, including PCB manufacturer and SMD assembler shall be considered. Additional important issues like signal and power integrity, thermal studies or mechanical assembly considerations coupling with design rules will also be highly desired. Main principle and approach is described in this paper.

Anglický abstrakt

This paper describes the main idea of EURIPIDES project Board on Board (BoB) supervised by Thales Communication. The aim of this project is to develop and validate an innovative solution for realization of high-density boards beyond the SMD limits found, remaining reliable and reparable. In more the challenge is to satisfy the customer demand regarding the reliability in harsh environments and in long mission profile. An innovative solution is to have two boards with components only on one face and assembled then in such a way that it is possible to take them apart if repairing is needed. To reach such challenging objective, all the supply chain is needed, from base materials provider up to end-users, including PCB manufacturer and SMD assembler shall be considered. Additional important issues like signal and power integrity, thermal studies or mechanical assembly considerations coupling with design rules will also be highly desired. Main principle and approach is described in this paper.

Dokumenty

BibTex 


@inproceedings{BUT100943,
  author="Ivan {Szendiuch} and Boleslav {Psota} and Alexandr {Otáhal} and Edita {Hejátková}",
  title="Board on Board New PCB Configuration Moving in 3D Packaging",
  annote="This paper describes the main idea of EURIPIDES project Board on Board (BoB) supervised by Thales Communication. The aim of this project is to develop and validate an innovative solution for realization of high-density boards beyond the SMD limits found, remaining reliable and reparable. In more the challenge is to satisfy the customer demand regarding the reliability in harsh environments and in long mission profile. An innovative solution is to have two boards with components only on one face and assembled then in such a way that it is possible to take them apart if repairing is needed. To reach such challenging objective, all the supply chain is needed, from base materials provider up to end-users, including PCB manufacturer and SMD assembler shall be considered. Additional important issues like signal and power integrity, thermal studies or mechanical assembly considerations coupling with design rules will also be highly desired. Main principle and approach is described in this paper.",
  address="Novapress sro",
  booktitle="THE INTERNATIONAL CONFERENCE - EDS, Brno 26 - 27 June 2013",
  chapter="100943",
  howpublished="print",
  institution="Novapress sro",
  year="2013",
  month="june",
  pages="224--227",
  publisher="Novapress sro",
  type="conference paper"
}