Course detail

Electronic Components Production

FEKT-MVSKAcad. year: 2017/2018

The subject gives basic overwiev about development in semiconductor chips, their production process, and also the conection on substrate. The basic steps for design, production and application of electronics components, integrated circuits a electronic systems is the item of this subjects. Microelectronics semiconductor components ( CMOS, BiCMOS, BIFET, etc.), hybrid circuits (thin and thick films), sensors and actuators, displeys etc. are main object. Modern assembly technologies for PC, telecomunication devices, automotive are presented and showed. SMT, MCM, CSP and Flip Chip are the main instruments in this way.
The subject offers good overwiev abou technological processes that are used for semiconductor technologies. Theoretical part gives the impact on the understanding of physical approaches and descriebes in the simple form the principle of resistors, capacitors, diodes and transistors. Student receive the ability to join the practical approach. Experimental lessons are supervised by expert from ON Semiconductor Czech Republic, s.r.o.

Language of instruction

Czech

Number of ECTS credits

6

Mode of study

Not applicable.

Learning outcomes of the course unit

The basic orientation in the modern semiconductor technologies, semiconductor circuits, equipments and systems

Prerequisites

The subject knowledge on the Bachelor´s degree level is requested.

Co-requisites

Not applicable.

Planned learning activities and teaching methods

Teaching methods depend on the type of course unit as specified in the article 7 of BUT Rules for Studies and Examinations. There are lessons, labs and excersizes included and also profesional text introduction. There is also e-learning (Moodle) included. Studend output is one own project.

Assesment methods and criteria linked to learning outcomes

Design of HIC, lab noticies and lessions matter

Course curriculum

Not applicable.

Work placements

Not applicable.

Aims

The main aim of this subject is to give a students basic knowledge about modern principles and methods used in design and production of electronic and electrotechnic circuits, equipments and systems regardind quality and productivity rules. The subject deals with basic physical principles for semiconductors including their production. In the practical part is the aim to verify the knowledge and ability in semiconductors in lab conditions.

Specification of controlled education, way of implementation and compensation for absences

The content and forms of instruction in the evaluated course are specified by a regulation issued by the lecturer responsible for the course and updated for every academic year.

Recommended optional programme components

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

SZENDIUCH, I. a kol. Technologie elektronických obvodů a systémů. GA102/00/ 0969. GA102/00/ 0969. Brno: Nakladatelství VUTIUM, Brno, 2002. 289 s. ISBN: 80-214-2072- 3. (CS)
I. Szendiuch, V. Musil, J. Stehlík. Výroba součástek a konstrukčních prvků. Elektronický studijní text. 2006. 84 str., VUT FEKT Brno. Brno: VUT Brno, 2006. s. 1 ( s.) (CS)
STRAKOŠ, V.: Výroba součástek a konstrukčních prvků. Prezentace projektu KISP, VUT v Brně, 2015 (CS) (CS)
MUSIL, V. a kol.: Výroba součástek a konstrukčních prvků. Nanotechnologie. Prezentace projektu KISP. VUT v Brně, 2015 (CS)
POOLE,C.P.(JR). -OWENS, F.J.: Introduction to Nanotechnology, Wiley Interscience, 2003 ISBN:0-471-07935-9 (EN)
DIVENTRA M., EVOY S., HEFLIN J. R.: Introduction to Nanoscale Science and Technology. Kluwer Academic Publishers, Boston 2004 (EN)
YING J. Y.: Nanostructured Materials. Academic Press, San Diego 2001(EN) STREETMAN, B.G. –BANERJEE, S.K.: Solid state electronic devices. Prentice Hall, 2010, ISBN 978-0-13-245479-7 (EN)

Recommended reading

Not applicable.

Classification of course in study plans

  • Programme EEKR-M1 Master's

    branch M1-EVM , 2. year of study, winter semester, optional specialized
    branch M1-MEL , 2. year of study, winter semester, compulsory

  • Programme EEKR-CZV lifelong learning

    branch ET-CZV , 1. year of study, winter semester, compulsory

Type of course unit

 

Lecture

39 hours, optionally

Teacher / Lecturer

Syllabus

Microelectronics and its trends, technological integration
Semiconductor components and chips
Future development in chip production, lithography
Chip assemblly - ultrasonic and termocompresion bonding
Thick and thin film technology and circuits
Hybrid Integrated Circuits
Surface Mounted Devices
SMT I - substrate and solder paste deposition
SMT II - component placement
SMT III - vawe and reflow soldering
Rework and repair in SMT
Quality and statistical process control
TQM, certifikation, CE

Laboratory exercise

26 hours, compulsory

Teacher / Lecturer

Syllabus

HI´C design and HIOCAD
Screen printing and Thick Film firing
Resistors trimming and ultrasonic bonding
Testing and packaging
Assembly of Fine Pitch components
Thick film sensors