Course detail
Electronic Components Production
FEKT-MVSKAcad. year: 2017/2018
The subject gives basic overwiev about development in semiconductor chips, their production process, and also the conection on substrate. The basic steps for design, production and application of electronics components, integrated circuits a electronic systems is the item of this subjects. Microelectronics semiconductor components ( CMOS, BiCMOS, BIFET, etc.), hybrid circuits (thin and thick films), sensors and actuators, displeys etc. are main object. Modern assembly technologies for PC, telecomunication devices, automotive are presented and showed. SMT, MCM, CSP and Flip Chip are the main instruments in this way.
The subject offers good overwiev abou technological processes that are used for semiconductor technologies. Theoretical part gives the impact on the understanding of physical approaches and descriebes in the simple form the principle of resistors, capacitors, diodes and transistors. Student receive the ability to join the practical approach. Experimental lessons are supervised by expert from ON Semiconductor Czech Republic, s.r.o.
Supervisor
Department
Learning outcomes of the course unit
The basic orientation in the modern semiconductor technologies, semiconductor circuits, equipments and systems
Prerequisites
The subject knowledge on the Bachelor´s degree level is requested.
Co-requisites
Not applicable.
Recommended optional programme components
Not applicable.
Recommended or required reading
Musil, V., Technologické procesy a jejich modelování, učební text, VUT v Brně, 1990 (CS)
SZENDIUCH, I. a kol. Technologie elektronických obvodů a systémů. GA102/00/ 0969. GA102/00/ 0969. Brno: Nakladatelství VUTIUM, Brno, 2002. 289 s. ISBN: 80-214-2072- 3. (CS)
I. Szendiuch, V. Musil, J. Stehlík. Výroba součástek a konstrukčních prvků. Elektronický studijní text. 2006. 84 str., VUT FEKT Brno. Brno: VUT Brno, 2006. s. 1 ( s.) (CS)
STRAKOŠ, V.: Výroba součástek a konstrukčních prvků. Prezentace projektu KISP, VUT v Brně, 2015 (CS) (CS)
MUSIL, V. a kol.: Výroba součástek a konstrukčních prvků. Nanotechnologie. Prezentace projektu KISP. VUT v Brně, 2015 (CS)
POOLE,C.P.(JR). -OWENS, F.J.: Introduction to Nanotechnology, Wiley Interscience, 2003 ISBN:0-471-07935-9 (EN)
DIVENTRA M., EVOY S., HEFLIN J. R.: Introduction to Nanoscale Science and Technology. Kluwer Academic Publishers, Boston 2004 (EN)
YING J. Y.: Nanostructured Materials. Academic Press, San Diego 2001(EN)
STREETMAN, B.G. –BANERJEE, S.K.: Solid state electronic devices. Prentice Hall, 2010, ISBN 978-0-13-245479-7
(EN)
Planned learning activities and teaching methods
Teaching methods depend on the type of course unit as specified in the article 7 of BUT Rules for Studies and Examinations. There are lessons, labs and excersizes included and also profesional text introduction. There is also e-learning (Moodle) included. Studend output is one own project.
Assesment methods and criteria linked to learning outcomes
Design of HIC, lab noticies and lessions matter
Language of instruction
Czech
Work placements
Not applicable.
Aims
The main aim of this subject is to give a students basic knowledge about modern principles and methods used in design and production of electronic and electrotechnic circuits, equipments and systems regardind quality and productivity rules. The subject deals with basic physical principles for semiconductors including their production. In the practical part is the aim to verify the knowledge and ability in semiconductors in lab conditions.
Specification of controlled education, way of implementation and compensation for absences
The content and forms of instruction in the evaluated course are specified by a regulation issued by the lecturer responsible for the course and updated for every academic year.
Classification of course in study plans
Type of course unit
eLearning
eLearning: currently opened course