Publication detail

Influence of thermal insulation material thickness used in wall footing to linear thermal transmittance

POSPÍŠIL, T. PĚNČÍK, J.

Original Title

Influence of thermal insulation material thickness used in wall footing to linear thermal transmittance

English Title

Influence of thermal insulation material thickness used in wall footing to linear thermal transmittance

Type

conference paper

Language

en

Original Abstract

Today the quality of design of building envelope is greatly emphasized. We are trying to design houses without problematic structural details, which would create so called thermal bridges - areas with higher heat flow then the rest of the structure. One group of these problematic details is situated in the connection between base of the wall and foundations under it. Here the thermal insulation layer of the floor is disrupted by the masonry of the walls and partitions. This thermal bridge can be quiet large – it depends on the ground plan of the building. Today exists a lot of ways to solve this structural detail. One of them is insertion of thermal insulation material (e.g. foam glass) between on top of the foundation, under the first row of masonry. This paper compares three variants of solutions for this problematic detail, using different thicknesses of foam glass. Two-dimensional temperature field models were created for the assessed variants. These models were compared by linear thermal transmittance.

English abstract

Today the quality of design of building envelope is greatly emphasized. We are trying to design houses without problematic structural details, which would create so called thermal bridges - areas with higher heat flow then the rest of the structure. One group of these problematic details is situated in the connection between base of the wall and foundations under it. Here the thermal insulation layer of the floor is disrupted by the masonry of the walls and partitions. This thermal bridge can be quiet large – it depends on the ground plan of the building. Today exists a lot of ways to solve this structural detail. One of them is insertion of thermal insulation material (e.g. foam glass) between on top of the foundation, under the first row of masonry. This paper compares three variants of solutions for this problematic detail, using different thicknesses of foam glass. Two-dimensional temperature field models were created for the assessed variants. These models were compared by linear thermal transmittance.

Keywords

steady state, foot of masonry, thermal bridges, linear thermal transmittance

RIV year

2013

Released

12.04.2013

ISBN

978-80-553-1305-4

Book

Young scientist 2013

Pages from

1

Pages to

7

Pages count

7

BibTex


@inproceedings{BUT99525,
  author="Tomáš {Pospíšil} and Jan {Pěnčík}",
  title="Influence of thermal insulation material thickness used in wall footing to linear thermal transmittance",
  annote="Today the quality of design of building envelope is greatly emphasized. We are trying to design houses without problematic structural details, which would create so called thermal bridges - areas with higher heat flow then the rest of the structure.
One group of these problematic details is situated in the connection between base of the wall and foundations under it. Here the thermal insulation layer of the floor is disrupted by the masonry of the walls and partitions. This thermal bridge can be quiet large – it depends on the ground plan of the building. Today exists a lot of ways to solve this structural detail. One of them is insertion of thermal insulation material (e.g. foam glass) between on top of the foundation, under the first row of masonry. 
This paper compares three variants of solutions for this problematic detail, using different thicknesses of foam glass. Two-dimensional temperature field models were created for the assessed variants. These models were compared by linear thermal transmittance.",
  booktitle="Young scientist 2013",
  chapter="99525",
  howpublished="electronic, physical medium",
  year="2013",
  month="april",
  pages="1--7",
  type="conference paper"
}