Publication detail

Cement-bonded chip boards using hemp and energy by-products in civil engineering

MELICHAR, T. BYDŽOVSKÝ, J. KEPRDOVÁ, Š.

Original Title

Cement-bonded chip boards using hemp and energy by-products in civil engineering

Type

journal article - other

Language

English

Original Abstract

The aim of the research presented in this article was studying the basic physico-mechanical parameters of cement-bonded chip boards with hemp used as filler and by-products of energy production applied when modifying the bonding component.

Keywords

Cement-bonded chip board, energy by-product, physical and mechanical parameters, organic substance.

Authors

MELICHAR, T.; BYDŽOVSKÝ, J.; KEPRDOVÁ, Š.

RIV year

2012

Released

14. 5. 2012

ISBN

1022-6680

Periodical

Advanced Materials Research

Year of study

2012

Number

512-515

State

Swiss Confederation

Pages from

2956

Pages to

2960

Pages count

5

BibTex

@article{BUT92536,
  author="Tomáš {Melichar} and Jiří {Bydžovský} and Šárka {Keprdová}",
  title="Cement-bonded chip boards using hemp and energy by-products in civil engineering",
  journal="Advanced Materials Research",
  year="2012",
  volume="2012",
  number="512-515",
  pages="2956--2960",
  issn="1022-6680"
}