Publication detail

Wetting Characteristics Study of Soldering Process in Nitrogen and Nitrogen/Hydrogen Atmosphere

STARÝ, J., KAZELLE, J.

Original Title

Wetting Characteristics Study of Soldering Process in Nitrogen and Nitrogen/Hydrogen Atmosphere

Type

conference paper

Language

English

Original Abstract

Lead free soldering implementation process needs some knowledge about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Material compatibility includes selection type of fluxes, soldering atmosphere, solder alloy composition, surface treatments of components and PCBs and optimized soldering process settings. Since 2006 lead solder will be substituted by lead-free. It is provided by ecological norms (ECO) and other related norms (i.e. WEEE – Waste Electrical and Electronic Equipment). Inert/inert-reduction atmosphere have to improve solder process yield effect. This short article is focused on very important part of soldering process – wetting phenomena

Keywords

lead free, solderability. wettability, surface finish, flux, nitrogen, forming gas

Authors

STARÝ, J., KAZELLE, J.

RIV year

2003

Released

1. 1. 2003

Publisher

VUT v Brně

Location

Brno

ISBN

80-214-2452-4

Book

Electronic Devices and Systems EDS 03

Edition number

první

Pages from

438

Pages to

441

Pages count

4

BibTex

@inproceedings{BUT8886,
  author="Jiří {Starý} and Jiří {Kazelle}",
  title="Wetting Characteristics Study of Soldering Process in Nitrogen and Nitrogen/Hydrogen Atmosphere",
  booktitle="Electronic Devices and Systems EDS 03",
  year="2003",
  number="první",
  pages="4",
  publisher="VUT v Brně",
  address="Brno",
  isbn="80-214-2452-4"
}