Publication detail

Levné 3-D pouzdření a multimodulové struktury

Original Title

Levné 3-D pouzdření a multimodulové struktury

Czech Title

Levné 3-D pouzdření a multimodulové struktury

Language

cs

Original Abstract

Since development of integrated circuit it has been known, that drastically increases number of leads, because it's structure is more complicated. Finally 3-D (three- dimension) technique permits by passing barrier of 100% of the efficiency of packaging. The research of this problem and especially low cost solution, seems to be very interesting a significant.

Czech abstract

Since development of integrated circuit it has been known, that drastically increases number of leads, because it's structure is more complicated. Finally 3-D (three- dimension) technique permits by passing barrier of 100% of the efficiency of packaging. The research of this problem and especially low cost solution, seems to be very interesting a significant.

BibTex


@inproceedings{BUT3338,
  author="Josef {Šandera} and Edita {Hejátková}",
  title="Levné 3-D pouzdření a multimodulové struktury",
  annote="Since development of integrated circuit it has been known, that drastically increases number of leads, because it's structure is more complicated. Finally 3-D (three- dimension) technique permits by passing barrier of 100% of the efficiency of packaging. The research of this problem and especially low cost solution, seems to be very interesting a significant.",
  address="Ing. Zdeněk Novotný, CSc, Brno, Ondráčkova 105",
  booktitle="8th Electronic Devices and Systems Conference 2001",
  chapter="3338",
  howpublished="print",
  institution="Ing. Zdeněk Novotný, CSc, Brno, Ondráčkova 105",
  year="2001",
  month="january",
  pages="199--204",
  publisher="Ing. Zdeněk Novotný, CSc, Brno, Ondráčkova 105",
  type="conference paper"
}