Publication detail

Textile-integrated electronics: state of the art

RAIDA, Z. LÁČÍK, J. DŘÍNOVSKÝ, J. CUPAL, M. PRÁŠEK, J. KRÁČALOVÁ, D. PROCHÁZKA, J. LÉDROVÁ, Z.

Original Title

Textile-integrated electronics: state of the art

Type

conference paper

Language

English

Original Abstract

The paper summarizes experience with the development of high-frequency electronic components which are manufactured on a three-dimensional knitted material instead of a conventional microwave substrate. Attention is turned to specific aspects of the design, manufacturing and integration of components to applications. Technological problems, which have not been solved yet, are discussed.

Keywords

Three-dimensional knitted fabric, sewing, screen printing, textile-integrated waveguide (TIW), textile-integrated antenna (TIA), vehicular applications

Authors

RAIDA, Z.; LÁČÍK, J.; DŘÍNOVSKÝ, J.; CUPAL, M.; PRÁŠEK, J.; KRÁČALOVÁ, D.; PROCHÁZKA, J.; LÉDROVÁ, Z.

Released

1. 10. 2020

Publisher

IEEE

Location

Varšava, Polsko

ISBN

978-83-949421-7-5

Book

Proceedings of MIKON 2020

Pages from

232

Pages to

236

Pages count

5

URL

https://ieeexplore.ieee.org/document/9253788

BibTex

@inproceedings{BUT165740,
  author="Zbyněk {Raida} and Jaroslav {Láčík} and Jiří {Dřínovský} and Miroslav {Cupal} and Jan {Prášek} and Dita {Kráčalová} and Jiří {Procházka} and Zdeňka {Lédrová}",
  title="Textile-integrated electronics: state of the art",
  booktitle="Proceedings of MIKON 2020",
  year="2020",
  pages="232--236",
  publisher="IEEE",
  address="Varšava, Polsko",
  doi="10.23919/MIKON48703.2020.9253788",
  isbn="978-83-949421-7-5",
  url="https://ieeexplore.ieee.org/document/9253788"
}