Publication detail

Real-World Capacitor as a Memcapacitive Element

BIOLEK, Z. BIOLEK, D. KOLKA, Z. BIOLKOVÁ, V.

Original Title

Real-World Capacitor as a Memcapacitive Element

English Title

Real-World Capacitor as a Memcapacitive Element

Type

conference paper

Language

en

Original Abstract

The paper introduces the capacitor with anelastic dielectric as a memcapacitive system. Proposed SPICE macro model allows experiments with capacitors whose dielectric exhibits a combination of elastic and anelastic effects. The voltage-charge pinched hysteresis loop as well-known fingerprint of memcapacitive systems can be observed for sinusoidal excitation.

English abstract

The paper introduces the capacitor with anelastic dielectric as a memcapacitive system. Proposed SPICE macro model allows experiments with capacitors whose dielectric exhibits a combination of elastic and anelastic effects. The voltage-charge pinched hysteresis loop as well-known fingerprint of memcapacitive systems can be observed for sinusoidal excitation.

Keywords

capacitor; elasticity; anelasticity; memcapacitive element; pinched hysteresis loop; SPICE

Released

10.10.2018

Publisher

IEEE

Location

Liptovský Mikuláš, Slovensko

ISBN

978-80-8040-547-2

Book

2018 New Trends in Signal Processing

Pages from

1

Pages to

6

Pages count

6

URL

BibTex


@inproceedings{BUT151074,
  author="Zdeněk {Biolek} and Dalibor {Biolek} and Zdeněk {Kolka} and Viera {Biolková}",
  title="Real-World Capacitor as a Memcapacitive Element",
  annote="The paper introduces the capacitor with anelastic dielectric as a memcapacitive system. Proposed SPICE macro model allows experiments with capacitors whose dielectric exhibits a combination of elastic and anelastic effects. The voltage-charge pinched hysteresis loop as well-known fingerprint of memcapacitive systems can be observed for sinusoidal excitation.",
  address="IEEE",
  booktitle="2018 New Trends in Signal Processing",
  chapter="151074",
  doi="10.23919/NTSP.2018.8524089",
  howpublished="electronic, physical medium",
  institution="IEEE",
  number="1",
  year="2018",
  month="october",
  pages="1--6",
  publisher="IEEE",
  type="conference paper"
}