Publication detail

Processing of Al-Sc aluminum alloy using SLM technology

KOUTNÝ, D. SKULINA, D. PANTĚLEJEV, L. PALOUŠEK, D. LENCZOWSKI, B. PALM, F. NICK, A.

Original Title

Processing of Al-Sc aluminum alloy using SLM technology

Type

conference paper

Language

English

Original Abstract

The proposed paper deals with the experimental determination of process parameters reaching densities >99 % for Scandium modified aluminum alloy (Scalmalloy®) processed by SLM 280HL. The alloy achieves significantly higher yield strength and higher elongation than the AlSi10Mg aluminum alloy figcommonly used. Potential of this alloy is for lightweight applications in space, aerospace, and automotive industries, where is a need of the best possible stiffness to weight ratio. Experiments were provided with different values of laser power and laser scanning speed. Layer thickness and other parameters stayed unchanged. The X-ray micro-computed tomography (μCT) scanning of the tensile specimen was used in order to obtain qualitative and quantitative information about the porosity.

Keywords

Selective Laser Melting; SLM; Al-Sc alloy; Scalmalloy®; Microstructure; Mechanical properties

Authors

KOUTNÝ, D.; SKULINA, D.; PANTĚLEJEV, L.; PALOUŠEK, D.; LENCZOWSKI, B.; PALM, F.; NICK, A.

Released

3. 9. 2018

Publisher

Elsevier BV

ISBN

2212-8271

Periodical

Procedia CIRP

Year of study

74

Number

2018

State

Kingdom of the Netherlands

Pages from

44

Pages to

48

Pages count

5

URL

https://linkinghub.elsevier.com/retrieve/pii/S2212827118308114

BibTex

@inproceedings{BUT150791,
  author="KOUTNÝ, D. and SKULINA, D. and PANTĚLEJEV, L. and PALOUŠEK, D. and LENCZOWSKI, B. and PALM, F. and NICK, A.",
  title="Processing of Al-Sc aluminum alloy using SLM technology",
  booktitle="10TH CIRP CONFERENCE ON PHOTONIC TECHNOLOGIES",
  year="2018",
  journal="Procedia CIRP",
  volume="74",
  number="2018",
  pages="44--48",
  publisher="Elsevier BV",
  doi="10.1016/j.procir.2018.08.027",
  issn="2212-8271",
  url="https://linkinghub.elsevier.com/retrieve/pii/S2212827118308114"
}