Publication detail
Estimation of the Thermal Contact Conductance From Unsteady Temperature Measurements
KVAPIL, J. POHANKA, M. HORSKÝ, J.
Original Title
Estimation of the Thermal Contact Conductance From Unsteady Temperature Measurements
English Title
Estimation of the Thermal Contact Conductance From Unsteady Temperature Measurements
Type
journal article in Web of Science
Language
en
Original Abstract
Thermal contact conductance is an important parameter for describing the heat transfer between two bodies. When two solids are put in contact and heat transfer occurs, a temperature drop is observed at the interface between the solids. This is caused by an imperfect joint, which occurs because the real surfaces are not perfectly smooth and flat. This paper describes an experimental device for the evaluation of the thermal contact conductance, which was designed and fabricated in the Heat Transfer and Fluid Flow Laboratory. This device was built mainly for simulating metal-forming conditions, which include high pressures (up to 360 MPa) and high temperatures (up to 1200 degC) in the contact of two solids. The principle of this investigation is the unsteady measurement of the temperatures of two solids that are put in contact under different conditions. The surface temperature and thermal contact conductance can be calculated from the measured temperatures by an inverse heat-transfer task. The measured temperature history and the calculated values of the thermal contact conductance for pilot tests are presented in this paper.
English abstract
Thermal contact conductance is an important parameter for describing the heat transfer between two bodies. When two solids are put in contact and heat transfer occurs, a temperature drop is observed at the interface between the solids. This is caused by an imperfect joint, which occurs because the real surfaces are not perfectly smooth and flat. This paper describes an experimental device for the evaluation of the thermal contact conductance, which was designed and fabricated in the Heat Transfer and Fluid Flow Laboratory. This device was built mainly for simulating metal-forming conditions, which include high pressures (up to 360 MPa) and high temperatures (up to 1200 degC) in the contact of two solids. The principle of this investigation is the unsteady measurement of the temperatures of two solids that are put in contact under different conditions. The surface temperature and thermal contact conductance can be calculated from the measured temperatures by an inverse heat-transfer task. The measured temperature history and the calculated values of the thermal contact conductance for pilot tests are presented in this paper.
Keywords
thermal contact conductance, inverse heat conduction problem, heat-transfer coefficient
RIV year
2015
Released
01.04.2015
Publisher
Institute of Metals and Technology
Location
Ljubljana, Slovinsko
Pages from
219
Pages to
222
Pages count
4
URL
BibTex
@article{BUT114837,
author="Jiří {Kvapil} and Michal {Pohanka} and Jaroslav {Horský}",
title="Estimation of the Thermal Contact Conductance From Unsteady Temperature Measurements",
annote="Thermal contact conductance is an important parameter for describing the heat transfer between two bodies. When two solids are put in contact and heat transfer occurs, a temperature drop is observed at the interface between the solids. This is caused by an imperfect joint, which occurs because the real surfaces are not perfectly smooth and flat. This paper describes an experimental device for the evaluation of the thermal contact conductance, which was designed and fabricated in the Heat Transfer and Fluid Flow Laboratory. This device was built mainly for simulating metal-forming conditions, which include high pressures (up to 360 MPa) and high temperatures (up to 1200 degC) in the contact of two solids. The principle of this investigation is the unsteady measurement of the temperatures of two solids that are put in contact under different conditions. The surface temperature and thermal contact conductance can be calculated from the measured temperatures by an inverse heat-transfer task. The measured temperature history and the calculated values of the thermal contact conductance for pilot tests are presented in this paper.",
address="Institute of Metals and Technology",
chapter="114837",
doi="10.17222/mit.2013.238",
howpublished="print",
institution="Institute of Metals and Technology",
number="2",
volume="49",
year="2015",
month="april",
pages="219--222",
publisher="Institute of Metals and Technology",
type="journal article in Web of Science"
}