Publication detail

Computational Modeling of Porous Ceramics with Bioactive Layer

MARCIÁN, P. VALÁŠEK, J. HRSTKA, M. MAJER, Z. ŠEVEČEK, O. PROFANT, T. DLOUHÝ, I. FLORIAN, Z.

Original Title

Computational Modeling of Porous Ceramics with Bioactive Layer

Type

conference paper

Language

English

Original Abstract

The paper deals with a creation of computational model of a high porous ceramic material. This type of material has a large-scale industrial utilization. The computational model was created based on micro-CT data in the ANSYS 14.0 software using Finite Element Method. A creation of a porous ceramic struts model which respect a micro architecture is quite difficult (computer demanding and micro-CT data). The micro-CT slices are converted into a 3D model using image processing (used software STL Model Creator). The local first principle stress was analyzed because, ceramic is the brittle material. Furthermore, the influence of the thick layer around the individual struts was analyzed.

Keywords

Foams Ceramic; Finite Elements Method; Image Processing; Stress – Strain Analysis; Micro-CT

Authors

MARCIÁN, P.; VALÁŠEK, J.; HRSTKA, M.; MAJER, Z.; ŠEVEČEK, O.; PROFANT, T.; DLOUHÝ, I.; FLORIAN, Z.

RIV year

2014

Released

6. 1. 2014

Publisher

Trans Tech Publications

Location

Switzerland

ISBN

978-3-03785-934-6

Book

MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE VII

ISBN

1013-9826

Periodical

Key Engineering Materials (print)

Year of study

592-593

Number

2014

State

Swiss Confederation

Pages from

378

Pages to

381

Pages count

4

BibTex

@inproceedings{BUT100903,
  author="Petr {Marcián} and Jiří {Valášek} and Miroslav {Hrstka} and Zdeněk {Majer} and Oldřich {Ševeček} and Tomáš {Profant} and Ivo {Dlouhý} and Zdeněk {Florian}",
  title="Computational Modeling of Porous Ceramics with Bioactive Layer",
  booktitle="MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE VII",
  year="2014",
  journal="Key Engineering Materials (print)",
  volume="592-593",
  number="2014",
  pages="378--381",
  publisher="Trans Tech Publications",
  address="Switzerland",
  doi="10.4028/www.scientific.net/KEM.592-593.378",
  isbn="978-3-03785-934-6",
  issn="1013-9826"
}