Publication detail

PROPERTIES OF 3D LTCC STRUCTURE INTERCONNECTIONS

NICÁK, M. PSOTA, B. KOSINA, P. STARÝ, J. ŠANDERA, J.

Original Title

PROPERTIES OF 3D LTCC STRUCTURE INTERCONNECTIONS

English Title

PROPERTIES OF 3D LTCC STRUCTURE INTERCONNECTIONS

Type

conference paper

Language

en

Original Abstract

This paper describes design, construction and also some recent tests of 3D stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC). These structures have a great potential to create compact structure combining multiple different modules in one package. Internal connections used in these 3D structures have an important role, because they not only provide electrical and signal connection, but they also present mechanical attachment between connected substrates. Goal of this work is to develop, simulate and evaluate new structures based on interesting zero shrink Heraeus HL2000 LTCC substrates, where dimples help to reduce thermo-mechanical stress and pads modified with copper to reduce problems with leaching.

English abstract

This paper describes design, construction and also some recent tests of 3D stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC). These structures have a great potential to create compact structure combining multiple different modules in one package. Internal connections used in these 3D structures have an important role, because they not only provide electrical and signal connection, but they also present mechanical attachment between connected substrates. Goal of this work is to develop, simulate and evaluate new structures based on interesting zero shrink Heraeus HL2000 LTCC substrates, where dimples help to reduce thermo-mechanical stress and pads modified with copper to reduce problems with leaching.

Keywords

Packaging, LTCC, ANSYS, Heraues, soldering

RIV year

2012

Released

28.06.2012

Publisher

Ing. Vladislav Novotný - Litera

Location

Tabor 43a,612 00 Brno

ISBN

978-80-214-4539-0

Book

Electronics Devices and Systems 2012

Edition

1

Edition number

1

Pages from

245

Pages to

251

Pages count

6

BibTex


@inproceedings{BUT95801,
  author="Michal {Nicák} and Boleslav {Psota} and Petr {Kosina} and Jiří {Starý} and Josef {Šandera}",
  title="PROPERTIES OF 3D LTCC STRUCTURE INTERCONNECTIONS",
  annote="This paper describes design, construction and also some recent tests of 3D stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC). These structures have a great potential to create compact structure combining multiple different modules in one package. Internal connections used in these 3D structures have an important role, because they not only provide electrical and signal connection, but they also present mechanical attachment between connected substrates. Goal of this work is to develop, simulate and evaluate new structures based on interesting zero shrink Heraeus HL2000 LTCC substrates, where dimples help to reduce thermo-mechanical stress and pads modified with copper to reduce problems with leaching.",
  address="Ing. Vladislav Novotný - Litera",
  booktitle="Electronics Devices and Systems 2012",
  chapter="95801",
  edition="1",
  howpublished="online",
  institution="Ing. Vladislav Novotný - Litera",
  year="2012",
  month="june",
  pages="245--251",
  publisher="Ing. Vladislav Novotný - Litera",
  type="conference paper"
}