Publication detail

Zero Shrink LTCC 3D Structure Interconnections

NICÁK, M. PSOTA, B. STARÝ, J. ŠANDERA, J. KOSINA, P.

Original Title

Zero Shrink LTCC 3D Structure Interconnections

English Title

Zero Shrink LTCC 3D Structure Interconnections

Type

conference paper

Language

en

Original Abstract

This paper describes design, construction and some recent tests of three dimensional stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC). These structures have a great potential to create compact structure combining multiple different modules in one package. Internal connections used in these 3D structures have an important role, because they not only provide electrical and signal connection, but they also present mechanical attachment between connected substrates. Goal of this work is to develop, simulate and evaluate new structures based on interesting zero shrink Heraeus HL2000 LTCC substrates, where dimples help to reduce thermo-mechanical stress and pads modified with copper to reduce problems with leaching.

English abstract

This paper describes design, construction and some recent tests of three dimensional stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC). These structures have a great potential to create compact structure combining multiple different modules in one package. Internal connections used in these 3D structures have an important role, because they not only provide electrical and signal connection, but they also present mechanical attachment between connected substrates. Goal of this work is to develop, simulate and evaluate new structures based on interesting zero shrink Heraeus HL2000 LTCC substrates, where dimples help to reduce thermo-mechanical stress and pads modified with copper to reduce problems with leaching.

Keywords

LTCC, soldering, leaching, structure, interconnection

RIV year

2012

Released

13.05.2012

Publisher

IEEE Xplore digital library

Location

Vienna University of Technology Gusshausstrasse 27-29 A-1040 WIEN - Austria

ISBN

978-1-4673-2241-6

Book

2012 35th International Spring Seminar on Electronics Technology (ISSE)

Pages from

128

Pages to

132

Pages count

4

URL

BibTex


@inproceedings{BUT93447,
  author="Michal {Nicák} and Boleslav {Psota} and Jiří {Starý} and Josef {Šandera} and Petr {Kosina}",
  title="Zero Shrink LTCC 3D Structure Interconnections",
  annote="This paper describes design, construction and some recent tests of three dimensional stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC). These structures have a great potential to create compact structure combining multiple different modules in one package. Internal connections used in these 3D structures have an important role, because they not only provide electrical and signal connection, but they also present mechanical attachment between connected substrates. Goal of this work is to develop, simulate and evaluate new structures based on interesting zero shrink Heraeus HL2000 LTCC substrates, where dimples help to reduce thermo-mechanical stress and pads modified with copper to reduce problems with leaching.",
  address="IEEE Xplore digital library",
  booktitle="2012 35th International Spring Seminar on Electronics Technology (ISSE)",
  chapter="93447",
  howpublished="online",
  institution="IEEE Xplore digital library",
  number="1",
  year="2012",
  month="may",
  pages="128--132",
  publisher="IEEE Xplore digital library",
  type="conference paper"
}