Publication detail

Possibilities of making 3D resistors in LTCC technology

KLÍMA, M. SZENDIUCH, I.

Original Title

Possibilities of making 3D resistors in LTCC technology

English Title

Possibilities of making 3D resistors in LTCC technology

Type

conference paper

Language

en

Original Abstract

The Article deals with three-dimensional (3D) resistors making in Low Temperature Co-fired Ceramic (LTCC) substrates. It is especially focused on a manner of fabrication and design for reliability and reproducibility. 3D resistors are created of vias filled with a resistive paste. To fill the vias, stencil-printing is used. There are two ways of their arrangement through more layers – directly in line or zigzag. The research targets on finding the optimal count of connected layers, structure of resistive paste after firing, scattering of values of resistivity.

English abstract

The Article deals with three-dimensional (3D) resistors making in Low Temperature Co-fired Ceramic (LTCC) substrates. It is especially focused on a manner of fabrication and design for reliability and reproducibility. 3D resistors are created of vias filled with a resistive paste. To fill the vias, stencil-printing is used. There are two ways of their arrangement through more layers – directly in line or zigzag. The research targets on finding the optimal count of connected layers, structure of resistive paste after firing, scattering of values of resistivity.

Keywords

LTCC, 3D resistor, resistive vias

RIV year

2012

Released

20.08.2012

ISBN

978-1-4673-2240-9

Book

Electronics Technology (ISSE), 2012 35th International Spring Seminar on Electronics Technology

Pages from

50

Pages to

54

Pages count

5

BibTex


@inproceedings{BUT93108,
  author="Martin {Klíma} and Ivan {Szendiuch}",
  title="Possibilities of making 3D resistors in LTCC technology",
  annote="The Article deals with three-dimensional (3D) resistors making in Low Temperature Co-fired Ceramic (LTCC) substrates. It is especially focused on a manner of fabrication and design for reliability and reproducibility. 3D resistors are created of vias filled with a resistive paste. To fill the vias, stencil-printing is used. There are two ways of their arrangement through more layers – directly in line or zigzag. The research targets on  finding the optimal count of connected layers, structure of resistive paste after firing, scattering of values of resistivity.",
  booktitle="Electronics Technology (ISSE), 2012 35th International Spring Seminar on Electronics Technology",
  chapter="93108",
  howpublished="online",
  year="2012",
  month="august",
  pages="50--54",
  type="conference paper"
}