Publication detail

Influence of Bump Height to Multisubstrate Structures Construction

BULVA, J., SZENDIUCH, I.

Original Title

Influence of Bump Height to Multisubstrate Structures Construction

Type

conference paper

Language

English

Original Abstract

This paper is focused on thermomechanical modelling of two substrates with different CTE, which can be used in various types of MSM. There can be used two materials, laminate FR4 and ceramic 96%Al2O3. The interconnection of substrates is done by solder joints, where lead free solder SnAgCu is investigated in this work. ANSYS software is used and results from several analyses are discussed. One of the main purposes is a comparison of thermomechanical properties of MSMs when solder bumps height is changed.

Key words in English

ANSYS, MSM, modelling, thermomechanical properties

Authors

BULVA, J., SZENDIUCH, I.

RIV year

2003

Released

1. 1. 2003

Publisher

Ing. Zdeněk Novotný CSc., Brno

Location

Brno

ISBN

80-214-2452-4

Book

Proceedings of 10-th Electronic Devices and Systems Conference 2003

Edition

Neuveden

Edition number

Neuveden

Pages from

377

Pages to

381

Pages count

5

BibTex

@inproceedings{BUT8128,
  author="Jindřich {Bulva} and Ivan {Szendiuch}",
  title="Influence of Bump Height to Multisubstrate Structures Construction",
  booktitle="Proceedings of 10-th Electronic Devices and Systems Conference 2003",
  year="2003",
  series="Neuveden",
  volume="Neuveden",
  number="Neuveden",
  pages="5",
  publisher="Ing. Zdeněk Novotný CSc., Brno",
  address="Brno",
  isbn="80-214-2452-4"
}