Publication detail

Modelling of 3D Multimodule Substrate

BULVA, J., SZENDIUCH, I.

Original Title

Modelling of 3D Multimodule Substrate

Type

conference paper

Language

English

Original Abstract

Electronic assembly tries to reach low cost and very fast design-to-production process. The stacked packages are one of possible ways of solution. This article focuses on thermomechanical modelling of two materials with different CTE, which are commonly used in today’s electronic devices – FR4 and ceramic material 96%Al2O3. These substrates are connected with lead free solder SnAgCu. ANSYS software is used and results from several analyses are discussed. One of the main purposes is a comparison of thermomechanical properties of MSMs when solder bumps changed diameter.

Key words in English

MSM, reliability, thermomechanical properties, packaging, modelling, ANSYS

Authors

BULVA, J., SZENDIUCH, I.

RIV year

2003

Released

1. 1. 2003

Publisher

International Microelectronics and Packaging Society Poland-Chapter

Location

Gliwice, Poland

ISBN

83-917701-0-9

Book

Proceedings of 27-th International Conference and Exhibition IMAPS-Poland 2003

Edition

Neuveden

Edition number

Neuveden

Pages from

126

Pages to

129

Pages count

4

BibTex

@inproceedings{BUT8127,
  author="Jindřich {Bulva} and Ivan {Szendiuch}",
  title="Modelling of 3D Multimodule Substrate",
  booktitle="Proceedings of 27-th International Conference and Exhibition IMAPS-Poland 2003",
  year="2003",
  series="Neuveden",
  volume="Neuveden",
  number="Neuveden",
  pages="4",
  publisher="International Microelectronics and Packaging Society Poland-Chapter",
  address="Gliwice, Poland",
  isbn="83-917701-0-9"
}