Publication detail

Dispensing process with additional ultrasonic energy

BURŠÍK, M. SZENDIUCH, I. JANKOVSKÝ, J.

Original Title

Dispensing process with additional ultrasonic energy

English Title

Dispensing process with additional ultrasonic energy

Type

conference paper

Language

en

Original Abstract

This paper deals with the dispensing of viscous materials, focused especially on thick film pastes and thixotropic materials. The main aim of our solution is to reduce the viscosity of paste and thus ensure better conditions for the deposition during deposition process

English abstract

This paper deals with the dispensing of viscous materials, focused especially on thick film pastes and thixotropic materials. The main aim of our solution is to reduce the viscosity of paste and thus ensure better conditions for the deposition during deposition process

Keywords

ultrasonic, dispensing, viscosity, thick film

RIV year

2011

Released

12.09.2011

Publisher

IMAPS-Europe

Location

Brighton, UK

ISBN

978-0-9568086-0-8

Book

Proceedings of 18th European microelectronics packaging conference EMPC 2011

Pages from

476

Pages to

479

Pages count

4

URL

BibTex


@inproceedings{BUT75511,
  author="Martin {Buršík} and Ivan {Szendiuch} and Jaroslav {Jankovský}",
  title="Dispensing process with additional ultrasonic energy",
  annote="This paper deals with the dispensing of viscous materials, focused especially on thick film pastes and thixotropic materials. The main aim of our solution is to reduce the viscosity of paste and thus ensure better conditions for the deposition during deposition process",
  address="IMAPS-Europe",
  booktitle="Proceedings of 18th European microelectronics packaging conference EMPC 2011",
  chapter="75511",
  howpublished="electronic, physical medium",
  institution="IMAPS-Europe",
  year="2011",
  month="september",
  pages="476--479",
  publisher="IMAPS-Europe",
  type="conference paper"
}