Publication detail
Dispensing process with additional ultrasonic energy
BURŠÍK, M. SZENDIUCH, I. JANKOVSKÝ, J.
Original Title
Dispensing process with additional ultrasonic energy
English Title
Dispensing process with additional ultrasonic energy
Type
conference paper
Language
en
Original Abstract
This paper deals with the dispensing of viscous materials, focused especially on thick film pastes and thixotropic materials. The main aim of our solution is to reduce the viscosity of paste and thus ensure better conditions for the deposition during deposition process
English abstract
This paper deals with the dispensing of viscous materials, focused especially on thick film pastes and thixotropic materials. The main aim of our solution is to reduce the viscosity of paste and thus ensure better conditions for the deposition during deposition process
Keywords
ultrasonic, dispensing, viscosity, thick film
RIV year
2011
Released
12.09.2011
Publisher
IMAPS-Europe
Location
Brighton, UK
ISBN
978-0-9568086-0-8
Book
Proceedings of 18th European microelectronics packaging conference EMPC 2011
Pages from
476
Pages to
479
Pages count
4
URL
Documents
BibTex
@inproceedings{BUT75511,
author="Martin {Buršík} and Ivan {Szendiuch} and Jaroslav {Jankovský}",
title="Dispensing process with additional ultrasonic energy",
annote="This paper deals with the dispensing of viscous materials, focused especially on thick film pastes and thixotropic materials. The main aim of our solution is to reduce the viscosity of paste and thus ensure better conditions for the deposition during deposition process",
address="IMAPS-Europe",
booktitle="Proceedings of 18th European microelectronics packaging conference EMPC 2011",
chapter="75511",
howpublished="electronic, physical medium",
institution="IMAPS-Europe",
year="2011",
month="september",
pages="476--479",
publisher="IMAPS-Europe",
type="conference paper"
}