Publication detail

3D LTCC and Flexible Structure Interconnections Based on Galvanized Layers

NICÁK, M. ŠANDERA, J.

Original Title

3D LTCC and Flexible Structure Interconnections Based on Galvanized Layers

English Title

3D LTCC and Flexible Structure Interconnections Based on Galvanized Layers

Type

conference paper

Language

en

Original Abstract

Interconnections have an important role in packaging as they not only provide electrical connection but they also act as mechanical attachment between connected substrates and are supposed to be as reliable as possible. This paper describes design, construction and some recent laboratory tests of 3D stacked structures, where different materials with different coefficient of thermal expansion are combined together in one package. Goal of this work is to develop reliable 3D stacked structure intercronnection method, which will allow connection between LTCC, Al2O3 and also flexible substrates.

English abstract

Interconnections have an important role in packaging as they not only provide electrical connection but they also act as mechanical attachment between connected substrates and are supposed to be as reliable as possible. This paper describes design, construction and some recent laboratory tests of 3D stacked structures, where different materials with different coefficient of thermal expansion are combined together in one package. Goal of this work is to develop reliable 3D stacked structure intercronnection method, which will allow connection between LTCC, Al2O3 and also flexible substrates.

Keywords

LTCC, 3D, interconnection, structure, packaging

RIV year

2011

Released

12.09.2011

Publisher

IMAPS-Europe

Location

Brighton, UK

ISBN

978-0-9568086-0-8

Book

Proceedings of 18th European microelectronics packaging conference EMPC 2011

Pages from

358

Pages to

361

Pages count

4

URL

BibTex


@inproceedings{BUT73400,
  author="Michal {Nicák} and Josef {Šandera}",
  title="3D LTCC and Flexible Structure Interconnections Based on Galvanized Layers",
  annote="Interconnections have an important role in packaging as they not only provide electrical connection but they also act as mechanical attachment between connected substrates and are supposed to be as reliable as possible. This paper describes design, construction and some recent laboratory tests of 3D stacked structures, where different materials with different coefficient of thermal expansion are combined together in one package. Goal of this work is to develop reliable 3D stacked structure intercronnection method, which will allow connection between LTCC, Al2O3 and also flexible substrates.",
  address="IMAPS-Europe",
  booktitle="Proceedings of 18th European microelectronics packaging conference EMPC 2011",
  chapter="73400",
  howpublished="print",
  institution="IMAPS-Europe",
  year="2011",
  month="september",
  pages="358--361",
  publisher="IMAPS-Europe",
  type="conference paper"
}