Publication detail

On the Application of 3D LTCC and Flexible Structures Based on Galvanized Layers

NICÁK, M. ŠANDERA, J.

Original Title

On the Application of 3D LTCC and Flexible Structures Based on Galvanized Layers

English Title

On the Application of 3D LTCC and Flexible Structures Based on Galvanized Layers

Type

conference paper

Language

en

Original Abstract

This paper describes design, construction and some recent tests of three dimensional stacked structures. These structures have great potential to realize compact structures combining multiple different applications in one package. Interconnections used in these structures pay important role in packaging. They not only provide electrical connection, but they also act as mechanical attachment between substrates and are supposed to be reliable. Approach mentioned in this paper might lead to increase of reliability of 3D interconnections. Goal of this work is development and implementation of reliable 3D stacked structures, where LTCC, Al2O3 and also flexible substrates can be connected together in one package by interconnections that are based on vacuum evaporated and galvanically reinforced conductive layers of several types - fixed planar and elastic ones, both in connection with solder balls.

English abstract

This paper describes design, construction and some recent tests of three dimensional stacked structures. These structures have great potential to realize compact structures combining multiple different applications in one package. Interconnections used in these structures pay important role in packaging. They not only provide electrical connection, but they also act as mechanical attachment between substrates and are supposed to be reliable. Approach mentioned in this paper might lead to increase of reliability of 3D interconnections. Goal of this work is development and implementation of reliable 3D stacked structures, where LTCC, Al2O3 and also flexible substrates can be connected together in one package by interconnections that are based on vacuum evaporated and galvanically reinforced conductive layers of several types - fixed planar and elastic ones, both in connection with solder balls.

Keywords

3D structures, LTCC, vacuum evaporation, galvanic processes

RIV year

2011

Released

11.05.2011

Publisher

Technická Univerzita Košice

Location

Košice, SK

ISBN

978-1-4577-2111-3

Book

ISSE 2011 - PROCEEDINGS

Edition

1.

Edition number

1

Pages from

109

Pages to

111

Pages count

3

URL

BibTex


@inproceedings{BUT73390,
  author="Michal {Nicák} and Josef {Šandera}",
  title="On the Application of 3D LTCC and Flexible Structures Based on Galvanized Layers",
  annote="This paper describes design, construction and some recent tests of three dimensional stacked structures. These structures have great potential to realize compact structures combining multiple different applications in one package. Interconnections used in these structures pay important role in packaging. They not only provide electrical connection, but they also act as mechanical attachment between substrates and are supposed to be reliable. Approach mentioned in this paper might lead to increase of reliability of 3D interconnections. Goal of this work is development and implementation of reliable 3D stacked structures, where LTCC, Al2O3 and also flexible substrates can be connected together in one package by interconnections that are based on vacuum evaporated and galvanically reinforced conductive layers of several types - fixed planar and elastic ones, both in connection with solder balls.",
  address="Technická Univerzita Košice",
  booktitle="ISSE 2011 - PROCEEDINGS",
  chapter="73390",
  edition="1.",
  howpublished="print",
  institution="Technická Univerzita Košice",
  journal="Electronics Technology (ISSE), 2011 34th International Spring Seminar on Electronics",
  year="2011",
  month="may",
  pages="109--111",
  publisher="Technická Univerzita Košice",
  type="conference paper"
}