Publication detail

To the Lead free Soldering Application Process

SZENDIUCH, I., STARÝ, J.

Original Title

To the Lead free Soldering Application Process

Type

presentation

Language

English

Original Abstract

Přednáška pojednává o problematice procesu bezolovnatého pájení

Keywords

bezolovnaté pájky, pájení

Key words in English

lead free, soldering

Authors

SZENDIUCH, I., STARÝ, J.

RIV year

2004

Released

20. 1. 2004

Publisher

IMAPS

Location

Lanškroun

Pages from

1

Pages to

25

Pages count

25

BibTex

@misc{BUT63318,
  author="Ivan {Szendiuch} and Jiří {Starý}",
  title="To the Lead free Soldering Application Process",
  booktitle="International Microelectronics and Packaging Society Workshop",
  year="2004",
  volume="2004",
  pages="25",
  publisher="IMAPS",
  address="Lanškroun",
  note="presentation"
}