Publication detail

Contribution to realization of 3D structures

NICÁK, M. SZENDIUCH, I.

Original Title

Contribution to realization of 3D structures

English Title

Contribution to realization of 3D structures

Type

abstract

Language

en

Original Abstract

This paper describes design, construction and some recent test results of lead-free soldered three-dimensional structures based on combination of stacked thick-film Al2O3 or LTCC and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls. This three dimensional technology offers great potential to very compact embedded structures which may include as hybrid integrated circuits (HIC) well as non-conventional applications (sensors, attenuators etc).

English abstract

This paper describes design, construction and some recent test results of lead-free soldered three-dimensional structures based on combination of stacked thick-film Al2O3 or LTCC and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls. This three dimensional technology offers great potential to very compact embedded structures which may include as hybrid integrated circuits (HIC) well as non-conventional applications (sensors, attenuators etc).

Keywords

Lead-free solder, solder joint, Al2O3, LTCC

Released

12.05.2010

Publisher

Oficyna Wydawnicza Politechniki Warszawskiej

Location

Warsaw, Poland

ISBN

978-83-7207-870-4

Book

Abstract proceedings. Polymer Electronics and Nanotechnologies: towards System Integration.

Edition number

1

Pages from

110

Pages to

111

Pages count

2

BibTex


@misc{BUT60945,
  author="Michal {Nicák} and Ivan {Szendiuch}",
  title="Contribution to realization of 3D structures",
  annote="This paper describes design, construction and some recent test results of lead-free
soldered three-dimensional structures based on combination of stacked thick-film Al2O3 or LTCC and
FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free
solder bumps made by solder paste stencil printing, and at second by bumps using combination of
paste and solder balls. This three dimensional technology offers great potential to very compact
embedded structures which may include as hybrid integrated circuits (HIC) well as non-conventional
applications (sensors, attenuators etc).",
  address="Oficyna Wydawnicza Politechniki Warszawskiej",
  booktitle="Abstract proceedings. Polymer Electronics and Nanotechnologies: towards System Integration.",
  chapter="60945",
  institution="Oficyna Wydawnicza Politechniki Warszawskiej",
  year="2010",
  month="may",
  pages="110--111",
  publisher="Oficyna Wydawnicza Politechniki Warszawskiej",
  type="abstract"
}