Publication detail

Multi Substrate Modules – Cheap Solution for 3D Packaging

SZENDIUCH, I., ŠANDERA, J., BÍLEK, J.

Original Title

Multi Substrate Modules – Cheap Solution for 3D Packaging

Type

conference paper

Language

English

Original Abstract

The stacked packages are one of the most significant advances for building modern electronic systems. They give a good opportunity to built high volume three-dimensional devices with requested quality. 3D packages deliver volumetric density through vertical stacking. This method integrates multiple substrates and chips in a package to provide higher levels of functionality that can be achieved through multiple package solutions technologies. The aim of this paper is to describe and discuss some of the possible solutions, which are currently followed by research project of the Czech Ministry of Education in the frame of Research Plan MSM 262200022 “MIKROSYT Microelectronic Systems and Technologies”, and at the same time by the Grant project FRVS IS 421920 “Innovation of Education of Microelectronics Assembly Technologies”.

Key words in English

3D structures, Stacking, Multi Substrate Modules (MSM), Ball-terminal, Edge-terminal

Authors

SZENDIUCH, I., ŠANDERA, J., BÍLEK, J.

RIV year

2002

Released

29. 9. 2002

Publisher

Pelkosen Painotuote

Location

Kiiminki, Finland

ISBN

951-98002-4-7

Book

Proceedings of The IMAPS Nordic Annual Conference Stockholm, 2002

Pages from

114

Pages to

235

Pages count

122

BibTex

@inproceedings{BUT5147,
  author="Ivan {Szendiuch} and Josef {Šandera} and Jaromír {Bílek}",
  title="Multi Substrate Modules – Cheap Solution for 3D Packaging",
  booktitle="Proceedings of The IMAPS Nordic Annual Conference Stockholm, 2002",
  year="2002",
  pages="122",
  publisher="Pelkosen Painotuote",
  address="Kiiminki, Finland",
  isbn="951-98002-4-7"
}