Publication detail

On the Application of Solder Balls for 3D Packaging

SZENDIUCH, I. NICÁK, M.

Original Title

On the Application of Solder Balls for 3D Packaging

English Title

On the Application of Solder Balls for 3D Packaging

Type

journal article

Language

en

Original Abstract

Deals with the Application of Solder Balls for 3D Packaging and modern electronic system configurations

English abstract

Deals with the Application of Solder Balls for 3D Packaging and modern electronic system configurations

Keywords

solder ball, soldering, 3D configuration, 3D packaging

RIV year

2010

Released

02.08.2010

Publisher

E.G.Leuze Verlag KG

Location

Německo

Pages from

1855

Pages to

1860

Pages count

6

BibTex


@article{BUT50612,
  author="Ivan {Szendiuch} and Michal {Nicák}",
  title="On the Application of Solder Balls for 3D Packaging",
  annote="Deals with the Application of Solder Balls for 3D Packaging and modern electronic system configurations",
  address="E.G.Leuze Verlag KG",
  chapter="50612",
  institution="E.G.Leuze Verlag KG",
  journal="PLUS",
  number="8",
  volume="2010",
  year="2010",
  month="august",
  pages="1855--1860",
  publisher="E.G.Leuze Verlag KG",
  type="journal article"
}