Publication detail

Wafer-level packaging vs. chip-level Packaging

SZENDIUCH, I.

Original Title

Wafer-level packaging vs. chip-level Packaging

English Title

Wafer-level packaging vs. chip-level Packaging

Type

conference paper

Language

en

Original Abstract

see paper

English abstract

see paper

RIV year

2001

Released

01.01.2001

Publisher

Ing. Zdeněk Novotný

Location

Brno

Pages from

54

Pages to

58

Pages count

5

BibTex


@inproceedings{BUT3727,
  author="Ivan {Szendiuch}",
  title="Wafer-level packaging vs. chip-level Packaging",
  annote="see paper",
  address="Ing. Zdeněk Novotný",
  booktitle="Intensive Training Programme in Electronic System Design, Proceedings",
  chapter="3727",
  institution="Ing. Zdeněk Novotný",
  year="2001",
  month="january",
  pages="54",
  publisher="Ing. Zdeněk Novotný",
  type="conference paper"
}