Publication detail

Contribution to realization of 3D structures

NICÁK, M. ŠANDERA, J. SZENDIUCH, I.

Original Title

Contribution to realization of 3D structures

English Title

Contribution to realization of 3D structures

Type

conference paper

Language

en

Original Abstract

This paper describes design, construction and some recent test results of lead-free soldered three-dimensional structures based on combination of stacked thick-film Al2O3 or LTCC and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls. This three dimensional technology offers great potential to very compact embedded structures which may include as hybrid integrated circuits (HIC) well as non-conventional applications (sensors, attenuators etc).

English abstract

This paper describes design, construction and some recent test results of lead-free soldered three-dimensional structures based on combination of stacked thick-film Al2O3 or LTCC and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls. This three dimensional technology offers great potential to very compact embedded structures which may include as hybrid integrated circuits (HIC) well as non-conventional applications (sensors, attenuators etc).

Keywords

3D, stacked, AL2O3, LTCC

RIV year

2010

Released

12.08.2010

Publisher

IEEE Xplore digital library

Location

Warsaw, Poland

ISBN

978-1-4244-7849-1

Book

33rd International Spring Seminar on Electronics Technology (ISSE), 2010

Pages from

156

Pages to

159

Pages count

3

URL

Documents

BibTex


@inproceedings{BUT35869,
  author="Michal {Nicák} and Josef {Šandera} and Ivan {Szendiuch}",
  title="Contribution to realization of 3D structures",
  annote="This paper describes design, construction and some recent test results of lead-free soldered three-dimensional structures based on combination of stacked thick-film Al2O3 or LTCC and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls. This three dimensional technology offers great potential to very compact embedded structures which may include as hybrid integrated circuits (HIC) well as non-conventional applications (sensors, attenuators etc).",
  address="IEEE Xplore digital library",
  booktitle="33rd International Spring Seminar on Electronics Technology (ISSE), 2010",
  chapter="35869",
  howpublished="print",
  institution="IEEE Xplore digital library",
  year="2010",
  month="august",
  pages="156--159",
  publisher="IEEE Xplore digital library",
  type="conference paper"
}