Publication detail

Thermomechanical Reliability of LF Solder SAC305 in SMT Chip Assembly

ŠANDERA, J.

Original Title

Thermomechanical Reliability of LF Solder SAC305 in SMT Chip Assembly

English Title

Thermomechanical Reliability of LF Solder SAC305 in SMT Chip Assembly

Type

conference paper

Language

en

Original Abstract

This paper focuses on the practical measurement of the reliability of the LF solder SAC305 connection SMT chip mounted component size 2512 on PCB with various surface finishing. It is HAL, immerse tin, galvanic gold. Reliabikity was terminated after temperature cycles +100C to 0C.

English abstract

This paper focuses on the practical measurement of the reliability of the LF solder SAC305 connection SMT chip mounted component size 2512 on PCB with various surface finishing. It is HAL, immerse tin, galvanic gold. Reliabikity was terminated after temperature cycles +100C to 0C.

Keywords

LF solder SAC305, Chip Components 2512, HAL, Immerse Tin, Galvanic gold

RIV year

2007

Released

20.09.2007

Publisher

Zdeněk Novotný

Location

Brno, 2007

ISBN

978-80-214-3470-7

Book

Electronic Devices and Systems, EDS 07, IMAPS CS International Conference 2007, Proceedings

Edition number

1

Pages from

276

Pages to

279

Pages count

4

BibTex


@inproceedings{BUT28860,
  author="Josef {Šandera}",
  title="Thermomechanical Reliability of LF Solder SAC305 in SMT Chip Assembly",
  annote="This paper focuses on the practical measurement of the reliability of the LF solder SAC305 connection SMT chip mounted component size 2512 on PCB with various surface finishing. It is HAL, immerse tin, galvanic gold. Reliabikity was terminated after temperature cycles  +100C to 0C.",
  address="Zdeněk Novotný",
  booktitle="Electronic Devices and Systems, EDS 07, IMAPS CS International Conference 2007, Proceedings",
  chapter="28860",
  institution="Zdeněk Novotný",
  year="2007",
  month="september",
  pages="276--279",
  publisher="Zdeněk Novotný",
  type="conference paper"
}