Publication detail

Effect of Lead-free Conductive Thick Film Materials on Ultrasonic Wire Bondability

SZENDIUCH, I. HEJÁTKOVÁ, E. NOVOTNÝ, M.

Original Title

Effect of Lead-free Conductive Thick Film Materials on Ultrasonic Wire Bondability

English Title

Effect of Lead-free Conductive Thick Film Materials on Ultrasonic Wire Bondability

Type

conference paper

Language

en

Original Abstract

deals with influence of lead-free thick film conductive materials on wire bonding

English abstract

deals with influence of lead-free thick film conductive materials on wire bonding

Keywords

lead-free, wire bonding

RIV year

2007

Released

09.05.2007

Publisher

TU Dresden

Location

Cluj-Napoca

Pages from

124

Pages to

129

Pages count

6

BibTex


@inproceedings{BUT28357,
  author="Ivan {Szendiuch} and Edita {Hejátková} and Marek {Novotný}",
  title="Effect of Lead-free Conductive Thick Film Materials on Ultrasonic Wire Bondability",
  annote="deals with influence of lead-free thick film conductive materials on  wire bonding",
  address="TU Dresden",
  booktitle="Proceedings ISSE 2007",
  chapter="28357",
  institution="TU Dresden",
  year="2007",
  month="may",
  pages="124--129",
  publisher="TU Dresden",
  type="conference paper"
}