Publication detail

Interconection In 3D Structure

KOSINA, P. HEJÁTKOVÁ, E. ŠANDERA, J.

Original Title

Interconection In 3D Structure

English Title

Interconection In 3D Structure

Type

conference paper

Language

en

Original Abstract

The paper is focuses on sintering LTCC Material for sintering and sintering without pre-processing.

English abstract

The paper is focuses on sintering LTCC Material for sintering and sintering without pre-processing.

Keywords

sintering, material, profile, wafer

RIV year

2008

Released

10.09.2008

Publisher

Ing. Zdeněk Novotný, CSc., Ondráčkova 105, 628 00 Brno

Location

Vysoké učení technické v brně, Antonínská 548/1, 602 00 Brno

ISBN

978-80-214-3717-3

Book

Electronic Devices and Systems IMAPS CS International Conference 2008 proceedings

Edition number

1

Pages from

261

Pages to

264

Pages count

4

BibTex


@inproceedings{BUT27500,
  author="Petr {Kosina} and Edita {Hejátková} and Josef {Šandera}",
  title="Interconection In 3D Structure",
  annote="The paper is focuses on sintering LTCC
Material for sintering and sintering without pre-processing.",
  address="Ing. Zdeněk Novotný, CSc., Ondráčkova 105, 628 00 Brno",
  booktitle="Electronic Devices and Systems IMAPS CS International Conference 2008 proceedings",
  chapter="27500",
  howpublished="print",
  institution="Ing. Zdeněk Novotný, CSc., Ondráčkova 105, 628 00 Brno",
  year="2008",
  month="september",
  pages="261--264",
  publisher="Ing. Zdeněk Novotný, CSc., Ondráčkova 105, 628 00 Brno",
  type="conference paper"
}