Publication detail

Thick Film Resistor Testing by Electro - Ultrasonic Spectroscopy with DC Electric Signal

TOFEL, P. SEDLÁKOVÁ, V. ŠIKULA, J.

Original Title

Thick Film Resistor Testing by Electro - Ultrasonic Spectroscopy with DC Electric Signal

English Title

Thick Film Resistor Testing by Electro - Ultrasonic Spectroscopy with DC Electric Signal

Type

conference paper

Language

en

Original Abstract

The new method of non-destructive testing of the thick film resistors is presented. There are two phenomena which lead to the resistance modulation: (i) The interaction of the charge carriers with phonons, (ii) The ultrasonic signal changes the contact area between the conducting grains in the resistor structure. Ultrasound-excited resistance change in polymer based thick film structures is about 0.005 to 1 , which corresponds to the relative resistance change of the order from 10-6. We suppose that the resistive structures with defects are more influenced by the ultrasonic vibrations. The intermodulation signal can be used as the quality and reliability indicator

English abstract

The new method of non-destructive testing of the thick film resistors is presented. There are two phenomena which lead to the resistance modulation: (i) The interaction of the charge carriers with phonons, (ii) The ultrasonic signal changes the contact area between the conducting grains in the resistor structure. Ultrasound-excited resistance change in polymer based thick film structures is about 0.005 to 1 , which corresponds to the relative resistance change of the order from 10-6. We suppose that the resistive structures with defects are more influenced by the ultrasonic vibrations. The intermodulation signal can be used as the quality and reliability indicator

Keywords

Elektro-Ultrasonic, rezistive change, DC voltage

RIV year

2008

Released

07.05.2008

Location

Hungary

ISBN

978-963-06-4915-5

Book

Reliability and Life-time Prediction ISSE2008

Edition

1

Edition number

1

Pages from

56

Pages to

57

Pages count

2

BibTex


@inproceedings{BUT26554,
  author="Pavel {Tofel} and Vlasta {Sedláková} and Josef {Šikula}",
  title="Thick Film Resistor Testing by Electro - Ultrasonic Spectroscopy with DC Electric Signal",
  annote="The new method of non-destructive testing of the thick film resistors is presented. There are two phenomena which lead to the resistance modulation: (i) The interaction of the charge carriers with phonons, (ii) The ultrasonic signal changes the contact area between the conducting grains in the resistor structure. Ultrasound-excited resistance change in polymer based thick film structures is about 0.005   to 1  , which corresponds to the relative resistance change of the order from 10-6. We suppose that the resistive structures with defects are more influenced by the ultrasonic vibrations. The intermodulation signal can be used as the quality and reliability indicator",
  booktitle="Reliability and Life-time Prediction ISSE2008",
  chapter="26554",
  edition="1",
  howpublished="print",
  year="2008",
  month="may",
  pages="56--57",
  type="conference paper"
}