Publication detail

Simulation of different substrates connection

Novotný, M., Szendiuch, I.

Original Title

Simulation of different substrates connection

English Title

Simulation of different substrates connection

Type

conference paper

Language

en

Original Abstract

This paper describes recent developments made to the finite element modeling of substrates interconnection, extending its capability to handle viscoplastic behavior. It also presents the validation of this approach and results obtained for an interconnection of different substrates.

English abstract

This paper describes recent developments made to the finite element modeling of substrates interconnection, extending its capability to handle viscoplastic behavior. It also presents the validation of this approach and results obtained for an interconnection of different substrates.

RIV year

2006

Released

01.01.2006

Publisher

VUT Brno

Location

Brno

ISBN

80-214-3246-2

Book

Proceedings EDS '06

Edition number

první

Pages from

499

Pages to

503

Pages count

5

BibTex


@inproceedings{BUT24669,
  author="Marek {Novotný} and Ivan {Szendiuch}",
  title="Simulation of different substrates connection",
  annote="This paper describes recent developments made to the finite element modeling of substrates interconnection, extending its capability to handle viscoplastic behavior. It also presents the validation of this approach and results obtained for an interconnection of different substrates.",
  address="VUT Brno",
  booktitle="Proceedings EDS '06",
  chapter="24669",
  institution="VUT Brno",
  year="2006",
  month="january",
  pages="499",
  publisher="VUT Brno",
  type="conference paper"
}