Publication detail

Wire Bonding Power Interconnection

NOVOTNÝ, M. DVOŘÁK, T. SZENDIUCH, I.

Original Title

Wire Bonding Power Interconnection

English Title

Wire Bonding Power Interconnection

Type

conference paper

Language

en

Original Abstract

This work describes chip interconnection. Especially thermomechanical stressing of these structures.

English abstract

This work describes chip interconnection. Especially thermomechanical stressing of these structures.

Keywords

Stress, wire bonding, chip interconnection, ANSYS

RIV year

2007

Released

01.01.2007

Location

Finsko

ISBN

978-952-99751-1-2

Book

Proceedings EMPC 2007 the 16th European Microelectronics and Packaging Conference & Exhibition, Part one

Edition number

první

Pages from

92

Pages to

94

Pages count

3

BibTex


@inproceedings{BUT23962,
  author="Marek {Novotný} and Tomáš {Dvořák} and Ivan {Szendiuch}",
  title="Wire Bonding Power Interconnection",
  annote="This work describes chip interconnection. Especially thermomechanical stressing of these structures.",
  booktitle="Proceedings EMPC 2007 the 16th European Microelectronics and Packaging Conference & Exhibition, Part one",
  chapter="23962",
  year="2007",
  month="january",
  pages="92--94",
  type="conference paper"
}