Publication detail

Thermomechanical Reliability of Lead-Free Solder Joint in SMT Assembly

ŠANDERA, J.

Original Title

Thermomechanical Reliability of Lead-Free Solder Joint in SMT Assembly

English Title

Thermomechanical Reliability of Lead-Free Solder Joint in SMT Assembly

Type

conference paper

Language

en

Original Abstract

It focuse practical measurement of the reliability of the LF solder connection SMT mounted components on PCB. A Special PCBs with various footprints and surface design were realized

English abstract

It focuse practical measurement of the reliability of the LF solder connection SMT mounted components on PCB. A Special PCBs with various footprints and surface design were realized

Keywords

reliability of solder joint, footprint, surface finishing, crack

RIV year

2007

Released

09.05.2007

Publisher

EDITURA MEDIAMIRA str. Horea nr. 47-49/1 400275 Cluj-Napoca C.P. 117,O.P. 1

Location

Cluj-Napoca, Romania

ISBN

978-973-713-174-4

Book

ISSE 2007, 30th. International Spring Seminar on Electronics Technology, Abstracts Proceedings

Edition number

1. vydání

Pages from

76

Pages to

77

Pages count

2

BibTex


@inproceedings{BUT22777,
  author="Josef {Šandera}",
  title="Thermomechanical Reliability of Lead-Free Solder Joint in SMT Assembly",
  annote="It focuse practical measurement of the reliability of the LF solder connection SMT mounted components on PCB. A Special PCBs with various footprints and surface design were realized",
  address="EDITURA  MEDIAMIRA str. Horea nr. 47-49/1 400275 Cluj-Napoca C.P. 117,O.P. 1",
  booktitle="ISSE 2007, 30th. International Spring Seminar on Electronics Technology, Abstracts Proceedings",
  chapter="22777",
  institution="EDITURA  MEDIAMIRA str. Horea nr. 47-49/1 400275 Cluj-Napoca C.P. 117,O.P. 1",
  year="2007",
  month="may",
  pages="76--77",
  publisher="EDITURA  MEDIAMIRA str. Horea nr. 47-49/1 400275 Cluj-Napoca C.P. 117,O.P. 1",
  type="conference paper"
}