Publication detail

Lead-free Solder Joint Quality Investigation

Szendiuch,I., Vaško,C., Cejtchaml,P.

Original Title

Lead-free Solder Joint Quality Investigation

English Title

Lead-free Solder Joint Quality Investigation

Type

conference paper

Language

en

Original Abstract

It is described lead-free solder joint behaviour

English abstract

It is described lead-free solder joint behaviour

Keywords

Solder joint, quality, reliability

RIV year

2006

Released

10.05.2006

Publisher

Verlag dr. Markus A. Deter

Location

Germany

ISBN

3-934142-23-0

Book

Proceedings of 29th International Spring Seminar on Electronics Technology

Edition number

1

Pages from

84

Pages to

87

Pages count

4

Documents

BibTex


@inproceedings{BUT19127,
  author="Ivan {Szendiuch} and Pavel {Cejtchaml} and Cyril {Vaško}",
  title="Lead-free Solder Joint Quality Investigation",
  annote="It is described lead-free solder joint behaviour",
  address="Verlag dr. Markus A. Deter",
  booktitle="Proceedings of 29th International Spring Seminar on Electronics Technology",
  chapter="19127",
  institution="Verlag dr. Markus A. Deter",
  year="2006",
  month="may",
  pages="84",
  publisher="Verlag dr. Markus A. Deter",
  type="conference paper"
}