Publication detail

Reliability of solar cell´s solder joints

Jakubka,L., Novotny,M., Hladik,J., Szendiuch,I.

Original Title

Reliability of solar cell´s solder joints

Type

conference paper

Language

English

Original Abstract

This work is about reliability of solar cell´s solder joints. Ceramic substrate and back side contact solar cells were used. The Ag paste was used as a conductive layer and lead free solder paste was chosen as a solder. 3 firing profiles in 4-zone furnace were tested. The thermal cycling is the next step. In the end of this work is the simulation in ANSYS.

Key words in English

Reliability, Interconnection, Back Side Contact Solar Cell, ANSYS

Authors

Jakubka,L., Novotny,M., Hladik,J., Szendiuch,I.

RIV year

2006

Released

1. 1. 2006

Publisher

Heinz Wohlrabe

Location

Dresden

ISBN

3-934142-23-0

Book

Proceeding of ISSE 2006

Edition number

první

Pages from

72

Pages to

76

Pages count

5

BibTex

@inproceedings{BUT18687,
  author="Luboš {Jakubka} and Marek {Novotný} and Jiří {Hladík} and Ivan {Szendiuch}",
  title="Reliability of solar cell´s solder joints",
  booktitle="Proceeding of ISSE 2006",
  year="2006",
  number="první",
  pages="5",
  publisher="Heinz Wohlrabe",
  address="Dresden",
  isbn="3-934142-23-0"
}