Publication detail

Investigation of solder joints strength

Cyril Vasko, Jiri Ohera, Ivan Szendiuch

Original Title

Investigation of solder joints strength

English Title

Investigation of solder joints strength

Type

conference paper

Language

en

Original Abstract

This paper deals with method for finding mechanical properties of solder joint. Basic aim is practical realization one’s select method namely shear strength finish of solder joint and their thermal fatigue variants on ceramic substrate. The test is execution on testing components soldered by tin-lead and lead-free solder. Acquired characteristic can subserve to definition influencing factors of strength and reliability soldered joint on ceramic substrate, primarily soldered by lead-free solder.

English abstract

This paper deals with method for finding mechanical properties of solder joint. Basic aim is practical realization one’s select method namely shear strength finish of solder joint and their thermal fatigue variants on ceramic substrate. The test is execution on testing components soldered by tin-lead and lead-free solder. Acquired characteristic can subserve to definition influencing factors of strength and reliability soldered joint on ceramic substrate, primarily soldered by lead-free solder.

Keywords

solder joints, strength, shear stress, lead-free

RIV year

2006

Released

01.05.2006

Publisher

TU Dresden

Location

Dresden

ISBN

3-934142-23-0

Book

ISSE 2006 Proceeding

Edition number

1

Pages from

123

Pages to

126

Pages count

4

BibTex


@inproceedings{BUT18549,
  author="Cyril {Vaško} and Ivan {Szendiuch}",
  title="Investigation of solder joints strength",
  annote="This paper deals with method for finding mechanical properties of solder joint. Basic aim is practical realization one’s select method namely shear strength finish of solder joint and their thermal fatigue variants on ceramic substrate. The test is execution on testing components soldered by tin-lead and lead-free solder. Acquired characteristic can subserve to definition influencing factors of strength and reliability soldered joint on ceramic substrate, primarily soldered by lead-free solder.",
  address="TU Dresden",
  booktitle="ISSE 2006 Proceeding",
  chapter="18549",
  institution="TU Dresden",
  year="2006",
  month="may",
  pages="123",
  publisher="TU Dresden",
  type="conference paper"
}