Publication detail

Finite Element Modeling of Surface Mount Devices

NOVOTNÝ, M., SZENDIUCH, I., BULVA, J.

Original Title

Finite Element Modeling of Surface Mount Devices

English Title

Finite Element Modeling of Surface Mount Devices

Type

conference paper

Language

en

Original Abstract

The aim of this work is to improve reliability of SMD connecting and to increase durability of these structures. Three-dimensional finite element analysis has been applied to determine the time-dependent solder joint fatigue response and under accelerated temperature cycling conditions (-40C to +125C, 15min ramps/15min dwells). And definition place with maximal stress value rising in solder joint under shearing. This paper describes recent developments made to the finite element modeling of SMD, extending its capability to handle viscoplastic behaviour. It also presents the validation of this approach and results obtained for an SMD. Lifetime predictions are made using the creep strain energy based models of Darveaux. This study discusses the analysis methodologies as implemented in the ANSYS finite element simulation software tool.

English abstract

The aim of this work is to improve reliability of SMD connecting and to increase durability of these structures. Three-dimensional finite element analysis has been applied to determine the time-dependent solder joint fatigue response and under accelerated temperature cycling conditions (-40C to +125C, 15min ramps/15min dwells). And definition place with maximal stress value rising in solder joint under shearing. This paper describes recent developments made to the finite element modeling of SMD, extending its capability to handle viscoplastic behaviour. It also presents the validation of this approach and results obtained for an SMD. Lifetime predictions are made using the creep strain energy based models of Darveaux. This study discusses the analysis methodologies as implemented in the ANSYS finite element simulation software tool.

RIV year

2005

Released

01.01.2005

Publisher

TU Wien

Location

Wien

ISBN

0-7803-9325-2

Book

Proceedings of ISSE 2005

Edition number

první

Pages from

97

Pages to

101

Pages count

5

BibTex


@inproceedings{BUT17411,
  author="Marek {Novotný} and Ivan {Szendiuch} and Jindřich {Bulva}",
  title="Finite Element Modeling of Surface Mount Devices",
  annote="The aim of this work is to improve reliability of SMD connecting and to increase
durability of these structures. Three-dimensional finite element analysis has been applied to determine
the time-dependent solder joint fatigue response and under accelerated temperature cycling conditions
(-40C to +125C, 15min ramps/15min dwells). And definition place with maximal stress value rising in
solder joint under shearing. This paper describes recent developments made to the finite element
modeling of SMD, extending its capability to handle viscoplastic behaviour. It also presents the
validation of this approach and results obtained for an SMD. Lifetime predictions are made using the
creep strain energy based models of Darveaux. This study discusses the analysis methodologies as
implemented in the ANSYS finite element simulation software tool.",
  address="TU Wien",
  booktitle="Proceedings of ISSE 2005",
  chapter="17411",
  institution="TU Wien",
  year="2005",
  month="january",
  pages="97",
  publisher="TU Wien",
  type="conference paper"
}