Publication detail

Comparing of 2D and 3D Modeling of MSM

BULVA, J., SZENDIUCH, I.

Original Title

Comparing of 2D and 3D Modeling of MSM

English Title

Comparing of 2D and 3D Modeling of MSM

Type

conference paper

Language

en

Original Abstract

This article focuses on thermomechanical modelling of connection of two different materials, which are often used in electronic devices – FR4 and ceramic material Al2O3. There are investigated combinations FR4-FR4, FR4-ceramic, ceramic-ceramic, connected with eutectic SnPb solder and Lead Free solders (SnAg, SnAgCu). In the first step, 2D modelling was used. This approach is simpler for model creating and more unpretentious for computing time than 3D modelling, which is used after.

English abstract

This article focuses on thermomechanical modelling of connection of two different materials, which are often used in electronic devices – FR4 and ceramic material Al2O3. There are investigated combinations FR4-FR4, FR4-ceramic, ceramic-ceramic, connected with eutectic SnPb solder and Lead Free solders (SnAg, SnAgCu). In the first step, 2D modelling was used. This approach is simpler for model creating and more unpretentious for computing time than 3D modelling, which is used after.

RIV year

2005

Released

02.02.2005

Publisher

IEEE

Location

Tarragona, Spain

ISBN

0-7803-8811-9

Book

2005 Spanish Conference on Electron Devices

Pages from

1

Pages to

3

Pages count

3

BibTex


@inproceedings{BUT16786,
  author="Jindřich {Bulva} and Ivan {Szendiuch}",
  title="Comparing of 2D and 3D Modeling of MSM",
  annote="This article focuses on thermomechanical modelling of connection of two different materials, which are often used in electronic devices – FR4 and ceramic material Al2O3. There are investigated combinations FR4-FR4, FR4-ceramic, ceramic-ceramic, connected with eutectic SnPb solder and Lead Free solders (SnAg, SnAgCu).
In the first step, 2D modelling was used. This approach is simpler for model creating and more unpretentious for computing time than 3D modelling, which is used after.",
  address="IEEE",
  booktitle="2005 Spanish Conference on Electron Devices",
  chapter="16786",
  institution="IEEE",
  year="2005",
  month="february",
  pages="1",
  publisher="IEEE",
  type="conference paper"
}