Publication detail

Optimalization and Investigation of the Free Air Ball Formation of the Gold Wire Bond

BÚRAN, M. ŘEZNÍČEK, M.

Original Title

Optimalization and Investigation of the Free Air Ball Formation of the Gold Wire Bond

English Title

Optimalization and Investigation of the Free Air Ball Formation of the Gold Wire Bond

Type

conference proceedings

Language

en

Original Abstract

This paper deals with Free air ball (FAB) formation and its optimization. It is part of the thermocompression of the thermosonic wire bonding process. This paper consists of a theoretical introduction to the topic and specific technological steps that is crucial for correct FAB formation. Technological parameters that can have an impact on the FAB formation process were analyzed. These are for example power of the electric discharge, length of the wire tail or protective atmosphere in the case of corrosive materials of the wire. The impact of these parameters on the quality of the reliability of the FAB and the wire-bonded joint were evaluated. At the end of this paper is a recommendation for the optimization of the wire bonding process for the small amount of the semiconductor chips.

English abstract

This paper deals with Free air ball (FAB) formation and its optimization. It is part of the thermocompression of the thermosonic wire bonding process. This paper consists of a theoretical introduction to the topic and specific technological steps that is crucial for correct FAB formation. Technological parameters that can have an impact on the FAB formation process were analyzed. These are for example power of the electric discharge, length of the wire tail or protective atmosphere in the case of corrosive materials of the wire. The impact of these parameters on the quality of the reliability of the FAB and the wire-bonded joint were evaluated. At the end of this paper is a recommendation for the optimization of the wire bonding process for the small amount of the semiconductor chips.

Keywords

Free air ball, optimization, gold, silver, wire tail, discharge

Released

30.04.2020

Location

Brno

ISBN

ISBN 978-80-214-5867

Book

Proceedings I of the 26th Conference STUDENT EEICT 2020

Pages count

5

URL

Documents

BibTex


@proceedings{BUT164494,
  author="Martin {Búran} and Michal {Řezníček}",
  title="Optimalization and Investigation of the Free Air
Ball Formation of the Gold Wire Bond",
  annote="This paper deals with Free air ball (FAB) formation and its optimization. It is part of the
thermocompression of the thermosonic wire bonding process. This paper consists of a theoretical
introduction to the topic and specific technological steps that is crucial for correct FAB formation.
Technological parameters that can have an impact on the FAB formation process were analyzed.
These are for example power of the electric discharge, length of the wire tail or protective atmosphere
in the case of corrosive materials of the wire. The impact of these parameters on the quality of the
reliability of the FAB and the wire-bonded joint were evaluated. At the end of this paper is a recommendation for the optimization of the wire bonding process for the small amount of the semiconductor chips.",
  booktitle="Proceedings I of the 26th Conference STUDENT EEICT 2020",
  chapter="164494",
  howpublished="online",
  year="2020",
  month="april",
  type="conference proceedings"
}