Publication detail

Influence of Electric Current at Solidification of Solder

OTÁHAL, A. SKÁCEL, J. SZENDIUCH, I.

Original Title

Influence of Electric Current at Solidification of Solder

English Title

Influence of Electric Current at Solidification of Solder

Type

conference paper

Language

en

Original Abstract

This paper deals with the possibility of affecting the creation of solder inner structure under the flow of electric current. The soldering apparatus with a special electrode system has been developed. The reflow of the solder occurred in a quartz glass tube where the brass electrodes were placed at each end of the tube. There have been tested two possibilities, with electric current and without current flow. The used inspection method was the optical inspection of micro-section cut with SEM microscopy.

English abstract

This paper deals with the possibility of affecting the creation of solder inner structure under the flow of electric current. The soldering apparatus with a special electrode system has been developed. The reflow of the solder occurred in a quartz glass tube where the brass electrodes were placed at each end of the tube. There have been tested two possibilities, with electric current and without current flow. The used inspection method was the optical inspection of micro-section cut with SEM microscopy.

Keywords

scanning electron microscopy, soldering, solders solidification,

Released

26.08.2019

Publisher

IEEE

Pages from

1

Pages to

5

Pages count

5

URL

BibTex


@inproceedings{BUT161228,
  author="Alexandr {Otáhal} and Josef {Skácel} and Ivan {Szendiuch}",
  title="Influence of Electric Current at Solidification of Solder",
  annote="This paper deals with the possibility of affecting the creation of solder inner structure under the flow of electric current. The soldering apparatus with a special electrode system has been developed. The reflow of the solder occurred in a quartz glass tube where the brass electrodes were placed at each end of the tube. There have been tested two possibilities, with electric current and without current flow. The used inspection method was the optical inspection of micro-section cut with SEM microscopy.",
  address="IEEE",
  booktitle="42nd International Spring Seminar on Electronics Technology (ISSE).",
  chapter="161228",
  doi="10.1109/ISSE.2019.8810308",
  howpublished="online",
  institution="IEEE",
  year="2019",
  month="august",
  pages="1--5",
  publisher="IEEE",
  type="conference paper"
}