Publication detail

Measurement of Gas Flow in Reflow Oven

SZENDIUCH, I. HURBAN, M.

Original Title

Measurement of Gas Flow in Reflow Oven

English Title

Measurement of Gas Flow in Reflow Oven

Type

conference paper

Language

en

Original Abstract

Measuring of gas flow inside of an reflow furnace is very important issue, helping to optimize heat transfer and decrease power consumption of such machine. Nowadays we are using lead free solder alloys and optimized profiling is a must for high quality of soldering joints and as low as possible void rate. Mostly in medical and automotive branches are these technological methods very important. Our target is reliable production, it means reliable products. This is the basics for longer lifetime of electronics at all. Measuring equipment for 3D measuring of a gas flow is one of very important things to reach this target.

English abstract

Measuring of gas flow inside of an reflow furnace is very important issue, helping to optimize heat transfer and decrease power consumption of such machine. Nowadays we are using lead free solder alloys and optimized profiling is a must for high quality of soldering joints and as low as possible void rate. Mostly in medical and automotive branches are these technological methods very important. Our target is reliable production, it means reliable products. This is the basics for longer lifetime of electronics at all. Measuring equipment for 3D measuring of a gas flow is one of very important things to reach this target.

Keywords

Reflow soldering, heat transfer coefficient, gas flow velocity, CTA.

Released

08.05.2019

Publisher

IEEE Computer Society

Location

Wroclaw, Poland

ISBN

9781538657300

Book

2019 42nd International Spring Seminar on Electronics Technology (ISSE)

Edition

Institute of Electrical andElectronics Engineering (IEEE)

Pages from

151

Pages to

154

Pages count

4

URL

BibTex


@inproceedings{BUT158383,
  author="Ivan {Szendiuch} and Milan {Hurban}",
  title="Measurement of Gas Flow in Reflow Oven",
  annote="Measuring of gas flow inside of an reflow furnace is very important issue, helping to optimize heat transfer and decrease power consumption of such machine. Nowadays we are using lead free solder alloys and optimized profiling is a must for high quality of soldering joints and as low as possible void rate. Mostly in medical and automotive branches are these technological methods very important. Our target is reliable production, it means reliable products. This is the basics for longer lifetime of electronics at all. Measuring equipment for 3D measuring of a gas flow is one of very important things to reach this target.",
  address="IEEE Computer Society",
  booktitle="2019 42nd International Spring Seminar on Electronics Technology (ISSE)",
  chapter="158383",
  doi="10.1109/ISSE.2019.8810150",
  edition="Institute of Electrical andElectronics Engineering (IEEE)",
  howpublished="electronic, physical medium",
  institution="IEEE Computer Society",
  number="1",
  year="2019",
  month="may",
  pages="151--154",
  publisher="IEEE Computer Society",
  type="conference paper"
}